Thursday, December 19, 2013 6:15:20 PM
“Implementation of this technique adds an energy per bit overhead” because remember that Thermoelectric devices require a DC power source to operate.
Implementation of this technique adds an energy per bit overhead of ~A$log2 N, where N is the total number of resonators and A is the 2-by-1 electrical multiplexer energy consumption for any given node [25]. For 45nm, 32nm, 22nm and 11nm CMOS nodes, the estimated energy consumption of this technique for a 64 resonant modulators with 53 active modulators and 11 redundant modulators will be 16.7fJ/bit 9.2fJ/bit, 4.0fJ/bit, and 1.2fJ/bit, respectively, regardless of the thermal variations [25]. (It does say "regardless of the thermal variation", that I find hard to believe)
Temperature-controlled setup.
In order to alter and record the chip temperature, a thermoelectric-cooler (TEC) was attached to the silicon substrate and a thermistor, placed adjacent to the silicon chip, was utilized to feedback temperature readout. Then, a commercial TEC proportional-integral-derivative (PID) controller was used to stabilize the chip temperature from 20°C to 30°C with ±0.05°C accuracy. The CW laser is set to (~1587.6nm and fiber to chip coupling is optimized for each temperature set point due to the thermal expansion of TEC.
Thermoelectric-cooler
Description: Thermoelectric coolers (TEC or Peltier) create a temperature differential on each side. One side gets hot and the other side gets cool. Therefore, they can be used to either warm something up or cool something down, depending on which side you use. You can also take advantage of a temperature differential to generate electricity.
Thermoelectrics are able to heat and cool by simply reversing the polarity, which changes the direction of heat transfer. This allows temperature control to be very precise, where up to ±0.01°C can be maintained under steady-state conditions. In heating mode TEMs are much more efficient than conventional resistant heaters because they generate heat from the input power supplied plus additional heat generated by the heat pumping action that occurs.
A design engineer should consider them when the system design criteria includes such factors as precise temperature control, high reliability, compact geometry constraints, low weight and environmental requirements. These products are ideal for many of the consumer, food & beverage, medical, telecom, photonics and industrial applications requiring thermal management.
http://www.google.com/url?sa=t&rct=j&q=&esrc=s&source=web&cd=1&cad=rja&ved=0CDMQFjAA&url=http%3A%2F%2Fwww.lairdtech.com%2Ftemhandbook%2F&ei=d3uzUqfLJtLJsQTcyYBA&usg=AFQjCNEusLCK9t1bePikp06jxEzQsRGmiQ
Gluck
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