Liquidmetal Technologies Inc (LQMT)

[Barney Vissur]

Looks like the resistance to beryllium lives on:

Materion Corporation – Ready for What’s Next in Electronics with New High-Performance Alloy Products

Materion Corp. (NYSE:MTRN)

Today : Tuesday 19 November 2013

Company invests in manufacturing upgrades to produce alloys for next-generation electronics

As the consumer electronics industry works to develop smaller, lighter devices that perform better and have ever-increasing capabilities, engineers need materials that enable – and even enhance – their next-generation designs. Materion Brush Performance Alloys, a Materion Corporation (NYSE:MTRN) business, is focused on meeting emerging electronics needs, and recently developed three new products for its BrushForm®158 product line (BF TM12, BF TM04 and BF TM06) specifically for next-generation electronics devices.

These new copper-nickel-tin alloys are designed to provide optimal strength in very thin gauges, making them ideal for use in devices such as smartphones, tablets and cameras.

The alloys offer higher strength than other copper alloys, but do not contain beryllium, so can be used when a beryllium-free alloy is desired. The materials are RoHS compliant and infinitely recyclable.

BrushForm®158 TM12 offers higher strength in thinner foil gauges

As electronic devices become smaller, design engineers face greater challenges to package new technologies and capabilities with less space for components. Designed specifically to meet increased strength requirements for voice coil motor and optical image stabilizing applications in smartphones, BF158 TM12 offers substantially higher strength in foil gauges as thin as .001” (.025 mm), which means greater design flexibility.

The alloy outperforms copper beryllium and copper titanium in applications with high strength/high temperature requirements – and has good corrosion resistance which is becoming increasingly important as companies develop water-resistant devices.

BrushForm TM04 and TM06 offers optimal high strength/formability combination