InvestorsHub Logo
Followers 25
Posts 1513
Boards Moderated 0
Alias Born 04/23/2010

Re: None

Thursday, 03/28/2013 12:44:16 PM

Thursday, March 28, 2013 12:44:16 PM

Post# of 196308
Doubt this has anything to do with us, but thought I would throw it out here for others (NVDA, see in bold below).

Less than a week to showtime,
-WISE GUY.


One of the clever architectures engineers in Nvidia’s labs are working on is a ground reference signaling scheme geared for future system-in-package devices. The approach, still in research, promises links running at less than half a picojoule per bit at 20 Gbits/second, said Dally.

The I/O could enable organic substrates that are less expensive than silicon interposers but need physically larger links. Nvidia wants individual links that run at 10 Gbits/second per pin, about ten times the rate of today's links, to enable components with 200 Gbytes/s bandwidth, Dally said.

IBM has used relatively large organic substrates for processor modules measuring as much as 100 mm on a side, Dally said. He sees the substrates used in 2.5-D stacks where a graphics die is laid next to a DRAM stack. Graphics chips generate too much heat to be stacked vertically with memories, and such stacks face relatively high costs and low yields, he added.

http://nextbigfuture.com/2013/03/the-next-semiconductor-node-only.html
Volume:
Day Range:
Bid:
Ask:
Last Trade Time:
Total Trades:
  • 1D
  • 1M
  • 3M
  • 6M
  • 1Y
  • 5Y
Recent LWLG News