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TI's New Customizable UMTS Infrastructure Chipset Slashes OEM ASIC



RELATED SYMBOLS: (TXN)

HOUSTON, Feb 3, 2003 /PRNewswire-FirstCall via COMTEX/ -- In a move that
fundamentally changes 3G channel card design, Texas Instruments Incorporated
(NYSE: TXN) (TI) today introduced a programmable chipset that enables cellular
infrastructure manufacturers to create low-cost, differentiated channel cards
for 3G base stations without the burden associated with developing their own
custom application specific integrated circuits (ASIC). The new chipset features
a digital signal processor (DSP) tailored for wireless infrastructure and
tightly coupled transmit and receive chip-rate application specific standard
products (ASSP). This efficient and customizable combination will speed
manufacturers to market with per-channel cost reductions of up to 50 percent.
(see www.ti.com/tci1xnr_wi )

Please Note: Texas Instruments is expanding its popular wireless technology
portfolio today. This news release is one of three complementary wireless
announcements issued this morning. Please visit www.ti.com/wirelesspr to view
the additional two news releases.

For manufacturers, the new programmable UMTS digital baseband chipset offers a
single platform that maintains the same flexibility as the popular
DSP-plus-custom-ASIC solution but at a substantially lower cost. The cost
savings come in two forms: first, manufacturers don't incur the development
expense of creating their own custom ASIC -- typically millions of dollars; and,
second, they get a substantial savings on bill of materials (BOM) cost because
the TI solution actually doubles channel density to 64 channels.

Of equal importance to cellular infrastructure manufacturers is the fact that
the cost savings are delivered without sacrificing the ability to customize and
differentiate their solution. In TI's chipset, the receive and transmit
chip-rate ASSPs consist of flexible hardware configured via registers and
commands under DSP software control, making differentiation not only possible,
but simple.

"The new UMTS chipset from TI gives 3G wireless infrastructure OEMs what they
want: improved cost and flexibility through the combined attributes of a DSP and
a customizable ASIC," said Dr. Jim Gunn, wireless infrastructure analyst for
Forward Concepts. "TI's innovative solution will help base station manufacturers
drive down the cost of their equipment while giving them the flexibility to
incorporate their algorithms and system intellectual property (IP)."

Chipset Features High-Performance DSP and Tightly Coupled ASSPs

The chipset includes the TMS320TCI100 DSP, the TMS320TCI110 receive chip rate
coprocessor and the TMS320TCI120 transmit chip rate coprocessor. Together, they
deliver all the benefits of a customizable ASIC and a DSP without the cost and
time to market disadvantages associated with custom ASIC developments.

The TCI100 DSP is pin and code compatible with the popular TMS3206416 DSP. Like
the 6416 DSP, the TCI100 DSP features two high-bandwidth parallel interfaces and
Viterbi and Turbo embedded coprocessors.

The TCI110 is a customizable receive chip rate ASSP. With it, designers have a
single device for finger de-spreading and random access channel (RACH) preamble
detection and searching for 64 users. This is a 2x improvement over solutions
available today, which support an average of 32 users. The TCI110 communicates
with the TCI100 DSP via a 64-bit memory interface bus that operates at a clock
rate of 122.88 MHz, giving the interface itself a bandwidth of 7.8 Gbps.

The TCI120 ASSP is highly flexible and supports a configurable number of sectors
and users per sector. It features multiple spreading, scrambling and channel
gain blocks, allowing any dedicated channel to be dynamically allocated across
any sector. The TCI120 includes a multi channel buffered serial port (McBSP)
interface for low-latency transfer of closed-loop data such as power control,
closed-loop transmit diversity and acquisition indicator channel (AICH)
information. TCI120 supports the newly standardized high-speed downlink packet
access UMTS channel, known as HSDPA, with appropriate modulation and slot format
options.

The new chipset also is designed to work with TI's recently announced GC5016
digital up/downconverter, the industry's first integrated four-channel wideband
digital downconverter and upconverter that is ideal for radios in 3G wireless
base transceiver systems.

Software and Development Tools Make The Chipset Easy To Use

The 3G product offering is augmented by development tools, foundation software
and modular UMTS chip rate and symbol rate application libraries all geared to
make the chipset easier to use and speed time to market. The tools include an
evaluation module (EVM), which enables customers to begin early code
development, and Code Composer Studio plug-in emulator probes that provide
real-time diagnostic visibility into both the TCI110 and TCI120.

TI is committed to the cellular infrastructure market and offers manufacturers a
broad product portfolio that includes tailored DSPs, ASSPs, high-performance
analog solutions and power management devices.

Chipset Availability

The TCI100 DSP, the TCI110 and the TCI120 are scheduled to be available through
TI in the third quarter of 2003. Download a white paper and UMTS chipset product
bulletin today at www.ti.com/tci1xwp_wi .

Limited preliminary samples of the GC5016 wideband digital downconverter and
upconverter are available today from TI. Production devices will be widely
available in the third quarter of 2003. Download the GC5016 data sheet today at
(www.ti.com/GC5016ds_wi ).

Safe Harbor Statement

Statements contained in this press release regarding product performance and
other statements of management's beliefs, goals and expectations may be
considered "forward-looking statements" as that term is defined in the Private
Securities Litigation Reform Act of 1995, and are subject to risks and
uncertainties that could cause actual results to differ materially from those
expressed or implied by these statements. The following factors and the factors
discussed in TI's most recent Form 10-K could cause actual results to differ
materially from the statements contained in this press release: delays in
implementation of the technology. We disclaim any intention or obligation to
update any forward-looking statements as a result of developments occurring
after the date of this press release.

Texas Instruments Incorporated provides innovative DSP and analog technologies
to meet our customers' real world signal processing requirements. In addition to
Semiconductor, the company's businesses include Sensors & Controls, and
Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and
has manufacturing, design or sales operations in more than 25 countries.

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN.
More information is located on the World Wide Web at www.ti.com .

TRADEMARKS

All trademarks and registered trademarks are the property of their respective
owners.

SOURCE Texas Instruments Incorporated


CONTACT: Becky Nevers of Texas Instruments Incorporated,
[phone], or [e-mail] ; or Krista Schuelke, [phone], or
[e-mail] , for Texas Instruments Incorporated. Please do not
publish these numbers or email addresses.

URL: http://www.ti.com/tci1xnr_wi
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Daniel Nieves