DPAC .55 + .08 BREAK OUT on news - has turned its business totally around. Great balance sheet considering what it is doing.
Mobile Computing Corp. Selects DPAC Technologies' 802.11b Solution for Telematics Applications
Business Wire - October 05, 2004 09:00
GARDEN GROVE, Calif., Oct 5, 2004 (BUSINESS WIRE) -- Mobile Computing Corp., Inc., a leading provider of mission-critical wireless enterprise business solutions for the transportation, logistics and field force automation markets, announces that it has selected the AirborneDirect(TM) Serial Bridge from DPAC Technologies (NASDAQ:DPAC) for its newest line of Telematics products.
Specifically, the DPAC serial bridge is being incorporated into Mobile Computing's m-LINX Mobile Worker product. According to David Cole, Mobile Computing Hardware Manager, "The AirborneDirect(TM) Serial Bridge was the only product meeting the full feature set required for m-LINX Mobile Worker, and it allowed us to get to market quicker than any other solution we evaluated."
The m-LINX Mobile Worker solution eliminates much of the manual paperwork required by both office staff and mobile workers by providing electronic versions that can be transferred wirelessly between the office and the field over any wireless network. Information in electronic form does not need to be entered multiple times eliminating tedious, time consuming and error prone office duties. The result is a more streamlined operation for the service organization.
"We're very pleased that Mobile Computing Corp., an internationally recognized leader in its industry, has chosen the AirborneDirect(TM) Serial Bridge for m-LINX Mobile Worker," says Greg Gower, DPAC Vice President, Sales and Business Development. "DPAC wireless solutions are designed to meet the challenges posed by the transportation and distribution industries' harsh operating environments. In addition, DPAC solutions are quickly integrated, enabling open standards-based wireless LAN connections."
DPAC's AirborneDirect(TM) product family provides LAN and Internet connectivity to the installed base of industrial OEM applications. Built around the Airborne(TM) Wireless LAN Node Module, the AirborneDirect(TM) Serial Bridge enables plug-and-play wireless LAN connectivity with devices that have an existing RS232/422/485 serial interface. For both the serial bridge and module, there's no need for an OEM to possess RF or communications expertise. In addition, there's no need to develop drivers or software.
About DPAC Technologies
Located in Garden Grove, Calif., DPAC Technologies provides embedded wireless networking and connectivity products to OEMs for machine-to-machine communication applications. DPAC's wireless products are used by major OEMs in the transportation, instrumentation and industrial control, homeland security, medical diagnostics, and logistics markets to provide remote data collection and control. The company's web site address is www.dpactech.com.
About Mobile Computing Corporation
Mobile Computing has provided wireless field force automation and logistics/distribution solutions since 1986. MCC's markets include waste transportation, fuel/petroleum transportation, organizations with mobile field service forces, newspaper and periodical distributors, office supplies, newspapers, and uniform deliveries. Every day, thousands of mobile workers rely on MCC's wireless mobile solutions to deliver goods and provide repair and maintenance services. The company's web address is www.mobilecom.com.
Forward-Looking Statements
This press release includes forward-looking statements, including statements regarding technology development, expansion and business plans that are subject to change, uncertainties and risks. Every statement herein that is not historic in nature is a forward-looking statement for purposes of the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Such statements involve risks and uncertainties, and therefore results may differ materially from those set forth in these statements. Factors that affect DPAC's business include, but are not limited to, the degree of market acceptance of our existing and planned wireless connectivity products, future business opportunities with these products, the IDA market and prospects for future considerations under this agreement, protection of licensed technology or proprietary rights, risks of litigation, and general market and economic conditions. More information about the risks and challenges faced by DPAC Technologies Corp. is contained in the Securities and Exchange Commission filings made by the Company on Form 10-K, 10-Q and 8-K. DPAC Technologies Corp. specifically disclaims any obligation to update or revise any forward-looking statements whether as a result of new information, future developments or otherwise.
SOURCE: DPAC Technologies
Schraff Group Communications for DPAC Technologies
Manuel J. Rodriguez, 949-837-7600, Ext. 223
manuel@schraff.com
or
Mobile Computing Corporation
Allan Bowman, 800-392-8651
allan.bowman@mobilecom.com
