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Press Release Source: ASAT Inc.


ASAT to Provide Flip Chip Technology to Shanghai Fudan Microelectronics Company Limited
Tuesday January 20, 4:00 am ET


HONG KONG and PLEASANTON, Calif., Jan. 20 /PRNewswire-FirstCall/ -- ASAT Holdings Limited (Nasdaq: ASTT - News) and ASAT Inc., global providers of semiconductor package design, assembly and test, today announced that it will provide flip chip land grid array (LGA) technology to Shanghai Fudan Microelectronics Company Limited for multimedia applications.
(Logo: http://www.newscom.com/cgi-bin/prnh/20030414/ASATLOGO )
ASAT's flip chip LGA is a chip scale package solution using high-end flip chip interconnect technology and a low-cost laminate substrate delivering one of the smallest form factor solutions available. This package offers an optimal solution for the design of compact products with limited board real estate. As a high volume packaging solution, this technology is particularly suited for the Company's newest high-speed flip chip assembly equipment.

"We believe ASAT is the only semiconductor assembly and test company offering flip chip LGA technology in China," said Neil Mclellan, chief technology officer of ASAT Inc. "Fudan's decision to integrate ASAT's flip chip technology into its multimedia products validates our commitment to expand our flip chip capability. With high-speeds, increased I/O and bump density requirements, the demand for flip chip technology continues to rise."

"To provide our customers with superior products, it is critical for us to deliver state-of-the-art technology," said Qiqi Ding, spokesperson for Shanghai Fudan Microelectronics Company Limited. "ASAT's flip chip LGA offers an exceptional solution for our multimedia products, and we are confident we will meet our customer needs for quality, performance and reliability."

Shanghai Fudan Microelectronics Company Limited

Shanghai Fudan Microelectronics Company Ltd. is a joint stock limited company. Its business covers design and development of ASIC and provides total solution for application specific systems. For more information visit www.fmsh.com.

ASAT Holdings Limited

ASAT Holdings Limited is a global provider of semiconductor assembly, test, and package design services. With 15 years of experience, the Company offers a definitive selection of semiconductor packages and world-class manufacturing lines. ASAT's advanced package portfolio includes standard and high thermal performance ball grid arrays, leadless plastic chip carriers, thin array plastic packages, system-in-package and flip chip. ASAT was the first company to develop moisture sensitive level one capability on standard leaded products. Today the Company has operations in the United States, Asia and Europe. ASAT Inc. is the exclusive distributor of ASAT Holdings Limited's services in the United States. For more information visit www.asat.com.

This news release contains forward-looking statements, which may involve uncertainties that could cause events to differ significantly from those implied by such statements. More information on potential factors that could affect the Company's results is included in the Company's most recent filings with the Securities and Exchange Commission.

Contact:

Connie Bordanaro
Marketing Communications Manager
ASAT Inc.
925-398-0431
[e-mail]

Neil Mclellan
Chief Technology Officer
ASAT Inc.
925-398-0443
[e-mail]


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