oknpv (thanx) et all re: bundling, functionalities, requirements, types of modules....
I´ll try to explain Waves modules, functionalities and bundling combinations with their requirements as I see it. I hope I´m not too far off, but I´m sure (and hope) our techies will correct me.
Waves software client sided:
- ESC/CSP
- ETDM (NOT stand alone a plugin into ESC)
- ETSL (same functionality as ETS but without CLIENT Key Transfer Manager and only 1 vault available regardless if local or on a mapped drive.
- ETS full functionality (except ETDM if NOT integrated in ESC)
Bundlings client sided:
- ESC/CSP: chip vendors to device manufacturers (mobos, drives...) OR PC OEMs on demand
- ETDM: drive manufacturers OR PC OEM depending on a distribution agreement
- ETSL: PC OEMs, mobo manufacturers and even chip manufacturers
- ETS. NO!!! bundling
OK lets begin at the lowest level of the supply chain the chip manufacturers:
They are bundling ESC and deliver it with the TPM to the mobo manufacturers or directly to the PC OEMs. Thats the 10centg deal. As an example ST delivered a bunch of TPMs to Dell, Intel and GTW, as the ship to (at least for us) unknown OEMs and whiteboxers. As we know ST still delivers to GTW and Intel, but they were kicked off Dell. To my surprise the ST revenues remained constant at least. Obviously ST has developed a new market in Asia, where ST has to deliver MORE = ETSL.
The TPM makers won´t ship anything if they aren´t ask to do so. Thats why we haven´t see much from Broadcom (HP) and Atmel, Winbond (Lenovo). ST and Winbond decided to enhance their offering and if I had to guess, I would say they were asked by customers to do it. ESC and ETSL is all about managing and using the TPM. Since TPMs become more and more visible the OEMs need to manage them, thats why we´ll see more and more new bundlings or amendments from exsisting partners.
IMO a chip maker will NEVER bundle ETDM.
The device maker (mobos) are the main the first main target for Wave for the ETSL bundle. Mobos are spread around the globe in EVERY single PC and other devices. All the big PC OEMs are using the same mobos from these manufacturers (of course there are lot of different mobos).
PC OEMs get ESC from the chip makers and add ETSL to our bottom line, but only if the PC OEM want the ESC. (Unfortunately not HP)
Wave will never get paid twice, but the more bundlings in the supply chain the better our saturation of the TPM market. For example imagine
- a small OEM with ST TPM and an Asus mobo. ST will deliver ETSL
- ST shipping to Intel: ESC, Intel ETSL
- BRCM to HP: NADA
- BRCM to DELL: ESC
......
ETDM:
It´s a plugin to ESC and for the client side you NEVER need ETSL or ETS if you look on the client ONLY.
Only drive makers and PC OEMs will bundle ESC/ETDM. Why should a chip maker or mobo manufacturer do so?
Functionalities and requirements:
ESC: TPM management client sided WITH client sided key management
ESC/ETDM: including preboot authentication of FDEs (even on machines without TPMs)
ETSL: including PIM, Vault etc....
ETS: including KEY TRANSFER MANAGER and multiple vaults.
Do we need ETS to be able to setup an FDE drive remotely with ERAS?
NO!!!!! We only need ESC/ETDM
Do we need ETS to be able to erase a drive remotely via ERAS?
NO!
Do we need ETS to restore the password if the user has forgotten his password? YES!!!
...and IMO it´s all about KEY management, storage and backup. With or without FDEs, ETS is needed IF you want to cetralize manage KEYs! (NOT FDEs, but their KEYs)
...IMO ERAS is scanning the network for ESC machines. ERAS is communicating with ESC to set up TPMs and with ETDM for the FDEs. I believe you can remotely do everything with ERAS until the user knows and changes the admin password. Then the FDE or TPM is out of control without ETS and EKTM on the server side.
So it wouldn´t make sense for ANY enterprise to buy FDEs or TPM machines WITHOUT server sided management tools!
And thats what we all are hoping for....
Hopefully you´ve made it down to this line and if so you´ve earned a BEST REGARDS!LOL
BR
ISPRO
