Lightwave Logic Inc (LWLG)

[prototype_101]

Dice, ECOC 9/23/24 Lebby "Commercial silicon foundry 200mm wafers where EO polymers HAVE BEEN easily integrated using standard PDKs."

ECOC 9/23/24 Lebby "Commercial silicon foundry 200mm wafers where EO polymers HAVE BEEN easily integrated using standard PDKs."

ECOC 9/23/24 Lebby "Commercial silicon foundry 200mm wafers where EO polymers HAVE BEEN easily integrated using standard PDKs."

ECOC 9/23/24 Lebby "Commercial silicon foundry 200mm wafers where EO polymers HAVE BEEN easily integrated using standard PDKs."

ECOC 9/23/24 Lebby "Commercial silicon foundry 200mm wafers where EO polymers HAVE BEEN easily integrated using standard PDKs."

ECOC 9/23/24 Lebby "Commercial silicon foundry 200mm wafers where EO polymers HAVE BEEN easily integrated using standard PDKs."

ECOC Market Focus Topics!! Polymers RULE!! Check it out!!!

September 23-25, 2024

Components/ICs/PICs/fiber
1. Classic component performance (discrete and
integrated photonics), ROADMs
2. High speed, low power modulators (polymer, TFLN,
plasmonic, Silicon, InP etc.)
3. Tunable and fixed wavelength devices
4. Future PIC trends, roadmaps, complexity with InP,
silicon photonics, polymers
5. VCSELs: high speed, arrays, smart pixels
6. Electronics (and associated modulation techniques
– PAM, QPSK, QAM etc.) for lightwave (DSPs, ASICs,
computational processing)
7. Advanced packaging trends (low cost, high speed,
volume driven, CoB, FC, interposers) and associated
testing techniques

https://www.ecocexhibition.com/wp-content/uploads/ECOC2024-Market-Focus-Call-For-Speakers.pdf

LWLG Most Innovative Product Award Finalist

ECOC 2024 Hybrid PIC / Optical Integration Platform

https://pbs.twimg.com/media/GTUvX0HXoAAZIO2?format=jpg&name=small

ECOC - World class performance for 200Gbps PAM4 and 400Gbps PAM4 lanes from electro-optic polymer modulators

Michael Lebby, Lightwave Logic Inc

Electro-optic (EO) polymer modulators are a hot topic in the industry today as the industry strives to increase modulation speed while reducing optical network equipment power consumption, driven by G-AI needs to upgrade hypescaler datacenters. Polymer modulators are now showing world class performance for 200Gbps PAM4 lanes, with initial results at 400Gbps PAM4 lanes and headroom for 800Gbps lanes as polymers have significant bandwidth capability. This enables not only 4 channel by 200Gbps PAM4 lanes for 800Gbps pluggable transceivers today, but also 4 channel by 400Gbps PAM4 lanes for 1.6Tbps pluggable transceivers soon. Further, polymer modulators have the capability for 4 channel by 800Gbps PAM4 lanes for 3.2Tbps pluggable transceivers using 800G lanes as part of a technology roadmap plan. Recent world class EO polymers results include:

1) Clean PAM4 eye diagrams at 200Gbps with less than 1V drive voltage.

2) Super high bandwidth polymer based plasmonic devices that exceed 250GHz (EO S21 3dB) for 400Gbps PAM4 lane applications for4 channel by 400Gbps PAM4 (1.6Tbps) pluggable transceivers.

3) Very low voltage drive of ~0.5V (which allows direct drive from ICs, DSPs etc., and potentially can eliminate driver chips)

4) Very small footprint and size, which allows simple integration with PICs to turbo-boost silicon photonics. Tiny optical engines are ideal for pluggable and onboard-optic transceiver form-factors.

5) Commercial silicon foundry 200mm wafers where EO polymers have been easily integrated using standard PDKs.

The talk will discuss the latest world class results with commercial grade electro-optic polymer materials that are being licensed for device applications for datacom at 1310 and 1550nm. These devices are fabricated onto 200mm silicon commercial foundry wafers and perform to 200G lane specifications at drive voltages less than 1V (which supports the drive to lower power consumption). Packaged polymer modulators will show the latest reliability and lifetime performance for datacenter applications. Reliability and stability results will be presented to show the robustness of the technology platform with respect to thermal stability and photostability in testing on materials, packages, and boards. Plans for CSP (Chip Scale Packaging) for polymer PICs will be shown based on dielectric sealants such as Atomic Layer Deposition at temperatures suitable for organic, polymer material. The talk will also show how the performance of EO polymer modulators can extend to not only 800Gbps and 1.6Tbps transceivers, but also 3.2Tbps, 6.4Tbps and beyond using the natural bandwidth characteristics of Perkinamine® chromophore organic material family. With EO bandwidths that exceed 250GHz that have been demonstrated with Polariton, single line or lane data rates that exceed 800Gbps PAM4 possible which opens a path for multi-Tbps data rate pluggable transceiver designs that include 3.2Tbps and 6.4Tbps for an exciting technology roadmap using polymer materials.

https://www.ecocexhibition.com/visit/market-focus/market-focus-session-information/