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Wednesday, 06/26/2024 12:00:28 PM

Wednesday, June 26, 2024 12:00:28 PM

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This is an important announcement in that Intel has found success in its effort to utilize heterogenous integration with a co-packaged optical compute interconnect chiplet that exhibits lower power, high bandwidth with distances up to 100 meters. This would be used inside a data center to connect servers and would target AI uses.. The energy consumption of the module is about 5 pj/bit. LWLG has shown energy consumption anywhere from 1-5 pj/bit.

https://finance.yahoo.com/news/intel-demonstrates-first-fully-integrated-150000595.html


This is surprisingly good specifications for a co-packed device to replace traditional pluggable transceivers inside a data center. The operational distance is not very good but Intel believes they can get it to go a longer reach for a more competitive product.

From the release I found this very interesting.
"These PICs were packaged in pluggable transceiver modules, deployed in large data center networks at major hyperscale cloud service providers for 100, 200, and 400 Gbps applications. Next generation, 200G/lane PICs to support emerging 800 Gbps and 1.6 Tbps applications are under development."

To jump to those speed level I would imagine a new material would be needed. Could it be Perkinamine. I can't see where else they can accomplish that without it. Transceivers within the data center will likely be with a partner using the material and developing the device. The bottom line is Intel competitor or partner.
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