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Wednesday, 05/01/2024 3:28:53 PM

Wednesday, May 01, 2024 3:28:53 PM

Post# of 194469
LWLG Eliminates Power Hungry & Expensive Driver Chip!!!

Lebby quote came from the Wall Street Transcript Interview (TWST) with Dr. Lebby - August 17, 2023

TWST: So you’re looking at value pricing, where the part might be more expensive, but you’re providing more performance and using less power, and as a result it’s going to be less expensive.

Dr. Lebby: Also, you’re saving the customer architectural IC designs. You don’t need driver chips and they are really expensive, way more than what a device would cost. And so, you’re providing that advantage to network operators.

https://investorshub.advfn.com/boards/read_msg.aspx?message_id=172679450First

What Lebby told investors in that interview is that the cost of the device, ie the 4x200 PIC Modulator Array chip is LESS than the cost of the Driver(s) that it ELIMINATES!!! And folks, LWLG's technology is the ONLY Next-Gen technology that CAN ELIMINATE the Driver(s)!!!!

Also let's not forget that the Driver(s) is/are power hungry, I know when I asked Bard it responded that it accounted for 40% of the power usage on 8x100 800Gbs and perhaps that is/was high but regardless the Driver(s) is/are known as being a big power user in the Transceiver so if you can eliminate the Driver(s) you are saving a lot of power!!

So what's that worth to the Transceiver companies? you guessed it.... A WHOLE LOT!!!



Google/Amazon/Nvidia etc CEO talking to Chief Engineer of Photonics

CEO, so what do you think we should use for our true next-gen internet transmissions solution?

ENG, well we've been working hard to help you decide the BEST solution and here's what we've got, Mark L says TFLN is going to be the winner of all the materials out there

CEO, ok, so then TFLN must have all those things we spoke about right? Is TFLN incredibly small so as to free up space in the Transceiver box so we don't have to implement Co-Packaged Optics any time within the next several generations?
ENG, well no, actually LWLG Polymers fit 120 devices in the same space TFLN fits only 8, but Mark L says TFLN is going to be the winner of all the materials out there

CEO, ok, well then TFLN must be using the least power right?
ENG, well no, actually LWLG Polymers is the ONLY solution operating at sub-1Volt that ELIMINATE the power hungry and expensive Driver Chip, but Mark L says TFLN is going to be the winner of all the materials out there

CEO, ok, well then TFLN must have the lowest Optical Losses and will save us money on requiring less DSP usage right?
ENG, well no, actually LWLG Polymers has MUCH LOWER Optical Losses, but Mark L says TFLN is going to be the winner of all the materials out there

CEO, ok well TFLN must be SUPER COMPATIBLE with Standard Silicon Foundries right?
ENG, well no, actually LWLG Polymers are SUPER COMPATIBLE with Standard Silicon Foundries and we are not sure whether TFLN can be "shoehorned in" to a Silicon Foundry PDK yet but there are quite a few companies trying to do that right now, but Mark L says TFLN is going to be the winner of all the materials out there

CEO, ok, well I've heard that TFLN does not yet have a 200Gbs device capable of being mass produced at a large SiPh Foundry on 200mm Wafers?
ENG, sorry sir, NO they don't yet, but they are working really hard on that right now!!

CEO, what about LWLG Polymers, can they mass produce a 200Gbs device on 200mm Wafers at a large Foundry
ENG, well YES sir, they just got done demonstrating perfect Open Eyes of that very device at OFC to MANY Tier1's along with Research Analysts, etc, it was VERY IMPRESSIVE indeed, I was there!!! BUT may I remind you, Mark L says TFLN is going to be the winner of all the materials out there

CEO, well I actually know Micael Lebby and I know of all his credentials in leadership of the Photonics Industry, but I really hadn't considered what you are telling me about Mark L telling everyone that TFLN is the way to go, interesting, well I've come to my decision
ENG, well did I convince you? Are you going with TFLN as Mark L says is going to be the winner?

CEO, no actually I'm going with Lebby/LWLG and YOU'RE FIRED!!!

LWLG beats ALL Next-Gen Competitors hands down!!! Let's compare,

Understanding Figure of Merit (FOM) the BEST place to be on the chart shown on Slide 47 is the TOP and RIGHT of the chart, and notice this is EXACTLY where LWLG is shown as compared to the competing Next-Gen challengers!!!

https://api.mziq.com/mzfilemanager/v2/d/23d26d3e-c498-431f-ba5c-2250e5f374cb/9bec8dfc-0108-5227-4f5b-d31f67ae623a?origin=2

LWLG tops ALL competition in FOM scores by far!!!!

Let's discuss the Competition >> from the ASM video starting at about 21:06 investors learn that amazingly there is no REAL competition to LWLG's technology for transmitting data!!! The first slide on competition shown is #25 and it has columns for each of the competitive products and then down the page a list of attributes along with the comparable Ratings for each of them, LWLG's Polymers are by far and away TONS THE BEST versus ALL the competitors!!

Let's review each of the attributes and see why LWLG's technology is SO SUPERIOR to any/all of them

1) SPEED >> LWLG is TONS THE BEST with speeds over 100GHz with HEADROOM to go MUCH FASTER!!!!! The rest of the competitors MAX OUT in the 30GHz - 70GHz range!!!

2) SIZE >> LWLG's slot modulator is the smallest, InP comes closest, but LNb, TFLN, and BTO are all MUCH BIGGER, in fact in another slide Lebby compares LWLG's slot modulator array to TFLN and in the space where 8 TFLN modulators sit, there could be 15 times as many LWLG slot modulators (120 modualtors!!)

3) POWER (Voltage) >> Only LWLG's technology is at sub 1 volt, SiP up to 5 volts, InP up to 7 volts, LNb up to 40 volts, TFLN up to 5 volts, BTO up to 3 volts

4) OPTICAL LOSS >> again LWLG slot is BEST with 3-8Db, SiP up to 20Db, InP up to 10Db, LNb up to 12Db, TFLN up to 15Db, BTO up to 12Db

5) ENERGY CONSUMPTION >> LWLG is BEST again with just 5pj/bit!!! SiP up to 20pj/bit, InP up to 40pj/bit, LNb up to 100pj/bit, TFLN up to 20pj/bit, BTO up to 20pj/bit

6) STABILITY >> again LWLG is the BEST, while SiP and InP are also very Stabile, the newcomers BTO and TFLN are NOT stabile enough for commercial acceptance!!

7) FOUNDRY COMPATABILITY >> Only LWLG and SiP use "Standard SiP PDK Fabrication", InP, LNb, TFLN and BTO are NOT able to use "Standard SiP PDK Fabrication" they all require their own Foundries

8) REQUIRES DRIVER (Expensive & Power Hungry!!!!) >> Only LWLG at sub 1 volt can ELIMINATE THE DRIVER!!!!! This is HUGE HUGE HUGE!!!!

Lebby also illustrates all of this at 25:18 marker with Slide #29 where the BEST technology would be found as HIGH UP and as FAR TO THE RIGHT as can be, notice ONLY one technology is placed there and it is of course LWLG in the light green shaded rectangle!!!



Folks, see it for yourselves starting at 21:06, LWLG is the hands down WINNER of the TRUE NEXT-GEN competition!!! NOTHING else is even close!!!!
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