Lightwave Logic Inc (LWLG)

[prototype_101]

PIC International Conference April 16-17 Brussels

Michael Lebby
CEO
Lightwave Logic Inc
Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.

Presentations
Hybrid PICs: Pioneering New Frontiers in Photonic Integration
High speed, low power, tiny modulators in a polymer PIC platform are poised to enable 800G/1.6Tbps data communications, driven in part by artificial intelligence.
The issue of reducing power consumption, increasing information in optical networks in a datacenter rich environment has become a huge topic of discussion at major optical communication conferences, and industry in general. Ultra-high speed, ultra-low power modulators, ultra-small foundry-based polymer modulators are seen to be an enabling technology that can help mitigate power consumption in transceivers, line cards, servers, and routers. This is especially the case where the appetite for artificial intelligence, machine learning is driving huge investments for higher performance datacenter equipment/cap ex. Electro-optic polymer modulators are now poised to address power consumption with their inherent ultra-high speed and very low power properties (>70GHz EO S21 3dB bandwidths, and sub 1V drive voltages). Electro-optic polymers are now additive with silicon foundries to integrated photonics platforms such as silicon photonics to increase performance significantly. The latest performance of polymer modulators will be reported that aligns very well with 800G and 1.6Tbps transceiver technology. This talk will also review the latest work in photonics industry decade roadmaps (that look out to 2030-2040) on both the integrated photonics (PIC) level for hybrid PICs, as well as PIC packaging level for the various technologies to package hybrid PICs.

Panel Sessions
Advancing the Frontier of Photonic Integration: Challenges and Innovations in PIC Packaging
Photonic Integrated Circuit (PIC) packaging is correctly redefined because of new challenges in miniaturization, efficiency and capacity demands driven by new trends, such as AI or quantum computing. This panel session aims to dissect the need for collaboration between equipment manufacturers, OSATs and their customers discussing the pivotal role of the photonic ecosystem in ensuring reliability, and optimal performance of PICs. The session will discuss the maturity, applicability and suitability for volume production of the latest advances in assembly and encapsulation techniques, efficient coupling strategies for light transmission, and the integration of PICs into diverse applications like communication networks and sensing systems.

https://picinternational.net/speakers