Today: Paper to be presented at OFC 2024: Presentation ID: W4H.5 Paper Title: Single Carrier net 400 Gbit/s IM/DD over 400 m Fiber Enabled by Plasmonic Mach-Zehnder Modulator
The Plasmonic Mach-Zehnder Modulator employing LWLG's EO polymers emerges as a particularly compelling choice for integration within a hybrid SiPh (Silicon Photonics) platform, as suggested by Google. The fusion of plasmonic technologies with advanced EO polymers opens a powerful avenue for achieving high data speeds and efficiency, crucial for the future evolution of optical communication systems. This approach holds particular promise for applications demanding the utmost in speed and efficiency, such as in data centers and high-performance computing applications.
"Additional On-Chip Capabilities":
Moreover, the unique combination of plasmonic effects and EO polymers provides additional opportunities beyond traditional communication systems, particularly in the realm of "on-chip" optical interconnects. The ability of plasmonic devices to confine light to sub-wavelength dimensions offers a path toward ultra-compact, high-speed modulators that could be integrated directly "onto silicon chips". This could revolutionize chip design by facilitating direct, high-speed optical communication between different parts of a chip or between different chips within a system, potentially bypassing some of the limitations of electronic interconnects.
This miniaturization and integration capability could lead to significant advancements in chip performance, reducing latency and increasing bandwidth within computing systems. On-chip optical interconnects enables more efficient data transfer between processors, memory units, and other components, which is crucial for the development of next-generation computing architectures, including those needed for artificial intelligence and machine learning applications.
The application of LWLG's EO polymers within plasmonic Mach-Zehnder modulators not only aligns with the immediate goals of enhancing data transmission rates and efficiency for telecommunications and data centers but also extends the horizon of silicon photonics into the realm of "on-chip" optical interconnects. This broader application spectrum underscores the transformative potential of combining plasmonic effects with advanced electro-optic materials, setting a foundation for future innovations in both telecommunications and computing technologies.
Bullish
