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Re: The Great Pumpkin post# 184914

Tuesday, 03/26/2024 10:34:30 AM

Tuesday, March 26, 2024 10:34:30 AM

Post# of 195126
GP, the press release yesterday clearly said that the testing they did, which was at 4 x 200 was on modulators that were “based on” 200 MM wafers.

Are there multiple ways to interpret what that means? Is it obvious from that wording that the modulators were those received back from the foundry on those wafers? Or could they have been using modulators created in house based on the designs that worked at the foundry level on 200 mm, but may have been suited only for 4x50 or 4x100?

I ask because the latest communication about that work was on Dec 4 and only said that they were planning to implement 4 x 200 and the foundries. How could they have received a wafer back with 4×200 that quickly?

I ask also because if all hurdles to 4 x 200 have been overcome, why have they not announced a transceiver partner or produced a demo by this point in time?
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