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Re: StevenDice post# 184462

Friday, 03/22/2024 9:19:43 AM

Friday, March 22, 2024 9:19:43 AM

Post# of 196823
This is unrelated to LWLG’s product roadmap.

While I acknowledge that there could be competing devices/tech at corporations that are unknown to the public…I read nearly every single white paper published on modulator technology so there is a very low chance something will blindside me.

Even privately within companies, what would be most likely to come out is more advanced development on devices found in others’ white papers.

Most TFLN and BTO development at private companies (large and small) is published in white papers anyway. For example, Huawei has a paper at OFC with an 8 inch BEOL wafer bonding process. THAT is bleeding edge. And it’s known.

I’ll agree though…for shareholders’ sake, LWLG must get their PIC into the marketplace this year/early next at the latest to catch the beginning of the wave while end-users are making their decisions.
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