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Re: The Great Pumpkin post# 179942

Wednesday, 02/14/2024 2:02:30 PM

Wednesday, February 14, 2024 2:02:30 PM

Post# of 195767
Damnit. HEY AGAIN lol...

This paper was initially published last summer. Since then, I spoke to authors on the paper and they admitted that for polymers they were not up to date on LWLG's reliability data and patents. The original date of the paper was June or July 2023 I believe. At that time, LWLG had not published any new data (except the very early 350 hours) on the packaged modulators with the new ALD.

The ALD creates the hermetic seal - CHECK.
Over 5,000 hours of thermal and photo stability achieved - CHECK.

That kind of photo stability is IMPOSSIBLE if the ALD wasn't working. 100% fact. That's why I've been saying the ALD works. Because if it didn't, it wouldn't survive photo stability testing.

As for reflow compatibility and CMOS foundry compatibility...the F in FBEOL stands for "Far". No reflow needed and it is up to LWLG and its foundry partners on who wants to take on the task of polymer deposition/poling.

I also discussed the paper with Lebby last summer and he called it "academic".

XOXO

PS - invite me to Moab next time. I have a toy for that.
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