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Friday, 02/09/2024 3:18:28 PM

Friday, February 09, 2024 3:18:28 PM

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Weekend reading: Report published February 2024: “Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP)”
https://semiengineering.com/heterogeneous-integration-and-electronics-packaging-manufacturing-roadmap-semi-ucla/
>>> The goal of MRHIEP is to develop an operational road map for jump starting advanced packaging in the US, with the creation of a quick-start guide for on-shore rapid development, piloting, prototyping and manufacturing. https://www.semi.org/sites/semi.org/files/2024-02/MRHIEP-Final-report-for-publication.pdf : >>> “ CONTRIBUTOR: Michael Lebby - Lightwave Logic Inc. “
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