Lightwave Logic Inc (LWLG)

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Chiplet Summit 2024' (Call for papers)
February 6-8, 2024
Santa Clara Convention Center
CONFERENCE & EXHIBITION
This is going to be HUGE!

About the Event
The Second Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive.

They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible.

This unique event gives attendees a place to network with peers, ask questions of the experts, and talk to vendors offering a wide variety of products and services.

https://chipletsummit.com

Keynote Speakers
Subi Kengeri
VP AI System Solutions, Applied Materials
Heterogeneous Integration in the AI Era

Wednesday, January 25, 2023 10:10-10:40

About the Speaker: Subi Kengeri is the Vice President of AI Systems Solutions at Applied Materials. His team is chartered with the goal of architecting next generation AI Systems leveraging Applied’s fundamental innovations.

Prior to joining Applied, Subi was the CTO and vice president of world-wide client solutions at Globalfoundries, responsible for enabling differentiated SoC and systems solutions. Subi joined Globalfoundries in 2009 as the vice president of global design solutions responsible for world-wide design engineering and semiconductor ecosystem development. He was responsible for determining technology feasibility, competitiveness, and manufacturability of technology platform through cross-functional collaboration of customers, R&D and ecosystem. In the role of vice president of CMOS Platforms Business Unit, Subi was responsible for business results.
Subi started his SoC design engineering career at Texas Instruments in 1991 and prior to joining Globalfoundries, he was the senior director of design-technology platform and head of North America Design center, at TSMC. Subi has been granted 47 U.S. design engineering patents and has given over 100 invited talks and press interviews.

Abstract: Semiconductor industry is at an inflection point. AI Compute requirements, specifically TOPs/W/$ needs, are growing exponentially while facing Moore’s Law scaling constraints. The future of the semiconductor industry is going to increasingly rely on new materials and newer approaches to integrating system functions. There will be a growing need to take a complete system to technology co-optimization approach with specific focus on system architecture, advanced packaging and software. This talk will cover why and how Heterogeneous Integration enables and catalyzes solutions required to meet system design challenges in the AI era.