Lightwave Logic Inc (LWLG)

[Pro_v12001]

GF Fotonix

We were able to take silicon and get it to behave like indium phosphide through use of differentiated features and unique materials, so that we could apply scale to this problem of supplying enough bandwidth.”

Silicon photonics promises to solve this problem, according to Yu, as it burns through only a third of the power in terms of picojoules per bit.

GF Fotonix supports a wide range of chip-packaging technologies, too. GlobalFoundries said that it can chisel “cavities” into the silicon die, giving customers an open slot to bond lasers directly to the die, resulting in cost, power, and space savings. The company also is able to carve out “grooves” in the die to support passive attachment of fiber optics—up to 16 fibers in the case of co-packaged optics—increasing bandwidth density.

https://www.electronicdesign.com/technologies/embedded-revolution/article/21239005/electronic-design-globalfoundries-its-time-for-silicon-photonics-to-shine