Lightwave Logic Inc (LWLG)

[Fruno]

The 2 patent applications should be viewed together. The application PR'd yesterday is incorporated into this newer one. The configuration of the device has been completely re-vamped in the earlier application (filed 12/14/2020). Previously, each part of the device was added as a separate layer, with the electrodes at the top and bottom. Poling couldn't happen until the device was fully assembled, which put some layers between the electrodes and the polymer.

The new configuration puts the electrodes and the polymer in the same layer. Poling can now happen as soon as the electrodes and polymer are in place, before the upper cladding and sealing layers are added, allowing for more control and predictability.

The newer application (filed 6/01/2021) describes sealing the device created using the design in the earlier application. If I understand it correctly, the sealer can be applied to an entire wafer - cheaper and faster than sealing each device.

Legal protection for the IP is effective as of the date the applications are filed (prosecution of infringement can't happen until patents are granted, however). The NDAs allow the company to discuss the new IP with partners, preventing IP theft. The new tech is the result of input and feedback from foundries over the last 2 years or so.