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Saturday, June 04, 2022 12:07:32 PM
This is figure 5A from the patent document, a top view of the monolithic PIC device described in the patent. (I added the notes to identify the components from the text.) Items 55, 56 and 58 are waveguides. Light from the laser flows through the waveguides. Note that section XX cuts through the modulator portion of the device, where light is divided into 2 waveguides.
![](http://i.ibb.co/pPGvdX1/1-11262605-device-top-view-5-A.jpg)
This is figure 6D, cross section XX through the modulator. Notice again that the "core" and upper cladding layer, both made of polymer, are confined within the waveguide. The text describes the manufacturing process as "forming an etched trench and depositing an oxide layer on the surface of the trench to planarize the surface prior to polymer deposition. A polymer based material is spun on/formed into the desired waveguide/modulator structure on top of or adjacent a laser formed in the platform/substrate."
![](http://i.ibb.co/bzNW6h1/2-11262605-Fig-6-D-x-section-of-mod.jpg)
This is Fig. 25, another, more detailed cross section, along the length of one of the modulator arms. It shows both a passive core (where the light is flowing) and an "active region", which is confined to the length of the modulator arm. This is the where the Perkinamine is. This polymer is confined to each arm of the modulator. It is "activated" by the electrodes above and below it. It causes the ability of light to flow in the passive core to change as the current rises and falls, encoding 1's and 0's into the flow of light.
![](http://i.ibb.co/pWns7kt/2-B-11262605-Fig-25-detailed-view-of-MZ-arm.jpg)
Fig. 26C is an isometric view of the modulator. The components include:
232: passive core region (in a waveguide)
234: the optical input
236: optical output
237/238: "arms" of the Mach-Zender modulator
246: lower electrode
248: lower cladding layer
This figure only show some of the layers making up the device.
![](http://i.ibb.co/vzSQ8wq/3-11262605-26-C-iso-view-of-mod.jpg)
Figure 26F shows more of the layers. Here, side and upper cladding layers were added, with the upper cladding shaped to contain the active polymer, indicated by 239/240.
![](http://i.ibb.co/W0MF9h5/4-11262605-26-F-iso-showing-active-polymer.jpg)
The last 2 figures are part of a series showing the manufacturing steps - how the various layers and components are added. There are 2 additional steps after Figure 26F, showing additional upper cladding placed over the active polymer, followed by the addition of the upper electrodes.
Getting back to the term "region-less", this from the patent:
"It should be noted that in active region-less polymer modulator the active components do not reach the edge of the chip but are confined within the periphery of the chip (hence 'region-less'). The use of a passive core with EO polymer active components adiabatically coupled thereto results in more efficient optical coupling between the modulator chip and the outside world, and with higher reliability, since the active material is never exposed to the outside world-atmosphere and with higher reliability, since the active material is not subject to optical reflections, rough surfaces, and other effects that could affect optical light transmission."
I don't mind posters questioning the technology - it's complex stuff that has been subject to research for decades. But please, try to understand what LWLG is doing before throwing out irrelevant crap. Koog was concerned about yield - Lebby answered that. GP is now concerned about the ability to scale, I guess because poling the polymer is difficult. He thinks it can't be done at scale in a foundry. This may be a legitimate concern, but, given that we have seen pictures of devices made in foundries, any concerns are being addressed and progress is being made. Lebby mentioned quality control as being worked on. The foundries wouldn't be wasting their time with LWLG if they didn't see the tech as viable.
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