Wednesday, March 02, 2022 8:21:34 AM
Our modulator devices, enabled by our electro-optic polymer material systems, work at extremely high frequencies (wide bandwidths) and possess inherent advantages over current crystalline electro-optic material contained in most modulator devices such as lithium niobate (LiNbO3), indium phosphide (InP), silicon (Si), and gallium arsenide GaAs).
Our Company has made various scientific breakthroughs that have allowed for the synthesis of proprietary organic polymer materials that can withstand extremely high process temperatures of 1750C. Additionally, these materials have demonstrated photochemical stability, even after being subjected to tensor light for over 4,000 hours and exhibited little electro optic degradation even after 2,500 hours of continuous exposure to temperatures at 1100C – exceeding typical commercial operating temperatures of approximately 850C, as found in data center applications. After successfully achieving material test results that either met or exceeded commercial requirements (subsequently confirmed by an outside entity).
Our electro-optic polymers can be integrated with other materials platforms because they can be applied as a thin film coating in a fabrication clean room such as may be found in semiconductor foundries. This approach we call Polymer Plus™. Our polymers are unique in that they are stable enough to seamlessly integrate into existing CMOS, Indium Phosphide (InP), Gallium Arsenide (GaAs), and other semiconductor manufacturing lines. Of particular relevance are the integrated silicon photonics platforms that combine optical and electronic functions. These include a miniaturized modulator for ultra-small footprint applications in which we term the Polymer Slot™. This design is based on a slot modulator fabricated into semiconductor wafers that include both silicon and indium phosphide.
Our company has a fabrication facility in Colorado to apply standard fabrication processes to our electro-optic polymers which create modulator devices. While our internal fabrication facility is capable of manufacturing modulator devices, we have partnered with commercial silicon-based fabrication companies that are called foundries who can scale our technology with volume quickly and efficiently. The process recipe for fabrication plants or foundries is called a ‘process development kit’ or PDK. We are currently working with commercial foundries to implement our electro-optic polymers into accepted PDKs by the foundries. Our work with the foundries is being focused with the Polymer Plus™ and the Polymer Slot™ polymer modulators.
Lightwave Logic, Inc. is developing next generation proprietary photonic devices that are based on our advanced electro-optical polymer material systems. Current legacy technology is based on inorganic crystalline materials, which has allowed for the proliferation of data over fiber optic cables. However, there are inherent molecular deficiencies that have prevented this technology from scaling down in price and up in functionality, especially in terms of $/Gbps. This is primarily due to a closed valence structure that does not allow for the molecular improvements. The valence or valency of an element is a measure of its combining power with other atoms when it forms chemical compounds or molecules. Also, the physical properties of a crystal do not allow for its implementation into highly miniaturize slot structures that are in simple terms the pathways that light travels through in the device.
The degree of miniaturization possible of the slot modulator using SiP is not technically feasible to accomplish with inorganic crystalline materials. Although this may not always remain the case, presently there are nearly insurmountable technical difficulties that are inherent to a crystalline molecule.
On August 4, 2021, we announced that we developed improved thermal design properties for electro-optic polymers used in our Polymer Plus™ and Polymer Slot™ modulators, enabling the speed, flexibility and stability needed for high-volume silicon foundry processes. We successfully created a 2x improvement in r33, while allowing higher stability during poling and post-poling. This provides better thermal performance and enables greater design flexibility in high-volume silicon foundry PDK (process development kit) processes.
Preliminary testing and initial data on our polymer photonics slot waveguide modulators demonstrated several promising characteristics. The tested polymer photonic chip had a 1-millimeter square footprint, enabling the possibility of sophisticated integrated optical circuits on a single silicon substrate. In addition, the waveguide structure was approximately 1/20 the length of a typical inorganic-based silicon photonics modulator waveguide.
We are continuing our collaborative development of our polymer photonic slot waveguide modulators (Polymer Slot™) with a partner that has advanced device design capabilities. We are now designing Polymer Slot™ modulators to operate at data rates greater than 50 Gbaud.
We are now optimizing our high-performance modulators against typical specifications that are required by the fiber communications industry. Furthermore, we are packaging our modulators with our packaging partner so that potential customers can evaluate our high-performance modulators in their systems.
Although we believe that our polymers will be the key differentiating factor in Polymer photonic devices, we do not currently possess the technical skills and instrumentation necessary to fabricate and test PICs at this dramatically reduced scale and intend to seek an external partner to assist with development.
On August 9, 2021, we announced the receipt of U.S. patent number 11,067,748 entitled "Guide Transition Device and Method" that covers a new invention that enables enhanced optical routing architectures for polymer-based integrated photonics that can be scaled with partner foundries. This new invention will enable innovative, highly scalable optical routing architectures for integrated photonic platforms. The patent provides novel optical waveguide transition designs using two planes of optical waveguides that are expected to be critical for optical signal routing and optical switching, opening the opportunity for high speed, energy efficient electro-optic polymers to be implemented into foundry PDKs (process development kits) to improve the performance of integrated photonic circuits. This breakthrough technology opens the door for advanced integrated photonics architectural design. We believe the simplicity of the design is ideal for production in foundries and will best position our Company to enable increased data traffic on the internet while using less power.
On January 3, 2022, we announced that we enhanced our Company’s Foundry Process Development Kit Offering with the addition of Optical Grating Couplers. This expanded design tool kit will enable silicon foundries to implement PDKs and fabricate modulators and optical gratings in a single fab run, further enhancing modulator efficacy. We are continuing to work on additional design tool kit components to enable an expedited commercialization process through a more simplified manufacturing process for our foundry partners.
As we move forward to diligently meet our goals, we continue to work closely with our packaging and foundry partners for the 50Gbaud and 100 Gbaud prototypes, and we are advancing our reliability and characterization efforts to support our prototyping. We partnered with silicon-based foundries in 2021 so that we can scale commercial volumes of electro-optic polymer modulator devices using large silicon wafers, and we are currently working to have our fabrication processes accepted into foundry PDKs (process development kits). These are the recipes that foundries use to manufacture devices in their fabrication plants.
This important achievement will allow users to utilize arrays of 4 x 50 Gbaud (4x 100 Gbps) polymer modulators using PAM-4 encoding to access 400 Gbps data rate systems. These ridge waveguide modulators are currently being packaged with our partner into prototype packages.
In 2021 we discussed the addition of silicon-based foundry partners to help scale in volume our polymer modulator devices.
Partnering with silicon-based foundries not only demonstrates that our polymer technology can be transferred into standard production lines using standard equipment, and also allows us to efficiently utilize our capital.
Currently the Company is in various stages of photonic device and materials development and evaluation with potential customers and strategic partners. The Company expects to obtain a revenue stream from technology licensing agreements, technology transfer agreements and the production and direct sale of its own electro-optic device components.
Recent LWLG News
- Lightwave Logic Reaffirms Commercialization Timeline Presented at the 2024 Annual Shareholder Meeting • PR Newswire (US) • 06/03/2024 12:31:00 PM
- Form 8-K - Current report • Edgar (US Regulatory) • 05/24/2024 08:01:14 PM
- Lightwave Logic and Advanced Micro Foundry (AMF) Partner to Accelerate Development of Silicon Photonics Modulators Using Electro-Optic Polymers • PR Newswire (US) • 05/21/2024 12:31:00 PM
- Lightwave Logic Provides First Quarter 2024 Corporate Update • PR Newswire (US) • 05/13/2024 12:31:00 PM
- Form 10-Q - Quarterly report [Sections 13 or 15(d)] • Edgar (US Regulatory) • 05/10/2024 08:41:09 PM
- Lightwave Logic Demonstrates Thought Leadership with Critical Contributions to Global Integrated Photonics Industry Roadmap • PR Newswire (US) • 04/16/2024 12:31:00 PM
- Lightwave Logic Secures New Patent for Diamondoid Non-linear Optical Chromophore Patent to Improves Material Robustness • PR Newswire (US) • 04/01/2024 12:31:00 PM
- Lightwave Logic EO Polymer Achieves World-Class Performance of 400Gbps with Plasmonic Mach Zehnder Modulator • PR Newswire (US) • 03/28/2024 12:31:00 PM
- Lightwave Logic Demonstrates World-Class 200Gbps Heterogeneous Polymer/Silicon Photonic Modulator Results • PR Newswire (US) • 03/25/2024 12:31:00 PM
- Lightwave Logic to Host Annual Meeting of Shareholders on May 22, 2024 • PR Newswire (US) • 03/19/2024 12:31:00 PM
- Lightwave Logic to Participate in Upcoming Investor Conferences • PR Newswire (US) • 03/15/2024 12:31:00 PM
- Lightwave Logic Provides Fourth Quarter and Fiscal Year 2023 Corporate Update • PR Newswire (US) • 03/01/2024 01:31:00 PM
- Form 10-K - Annual report [Section 13 and 15(d), not S-K Item 405] • Edgar (US Regulatory) • 02/29/2024 10:09:53 PM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 12/08/2023 09:00:04 PM
- Form 144 - Report of proposed sale of securities • Edgar (US Regulatory) • 12/07/2023 12:11:28 AM
- Lightwave Logic Issues Shareholder Letter and Provides Corporate Update • PR Newswire (US) • 12/04/2023 01:31:00 PM
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- Lightwave Logic Provides Third Quarter 2023 Corporate Update • PR Newswire (US) • 11/10/2023 01:31:00 PM
- Form 10-Q - Quarterly report [Sections 13 or 15(d)] • Edgar (US Regulatory) • 11/09/2023 09:24:23 PM
- Lightwave Logic to Participate in Upcoming Investor Conferences • PR Newswire (US) • 11/06/2023 01:31:00 PM
- Lightwave Logic CEO Dr. Michael Lebby to Present at the Optica Photonic-Enabled Cloud Computing Industry Summit • PR Newswire (US) • 10/12/2023 12:50:00 PM
- Lightwave Logic Receives 2023 Industry Innovation Award for Hybrid PIC/Optical Integration Platform at the European Conference on Optical Communications • PR Newswire (US) • 10/03/2023 12:31:00 PM
- Form 8-K - Current report • Edgar (US Regulatory) • 10/02/2023 08:00:08 PM
- Lightwave Logic to Participate in Upcoming Investor Conferences • PR Newswire (US) • 09/05/2023 12:31:00 PM
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