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Re: allwillbewave post# 3665

Saturday, 02/12/2022 8:51:20 PM

Saturday, February 12, 2022 8:51:20 PM

Post# of 6171
Broadcom teamed up with TSMC in 2020 to co develop broadcoms design of Broadcom’s chip to chip fabric architecture. TSMC had developed a 5nm node “ Chip on Wafer on Substrate” technology. It also can incorporate a photonic interconnect capability called Coupe ( Compact Universal Photonic Engine).

Celestial AI is going to use the TSMC / Broadcom 5 nm hardware and incorporate Poets custom Optical Engine codeveloped with Celestial to provide a remote light source module with multiple lasers.

Celestial AI brings their custom proprietary software to tie it all together.

Will Meta be one of Celestial AI’s first customers??

Probably.

My two cents.




https://hc33.hotchips.org/assets/program/tutorials/2021%20HotChips%20TSMC%20Packaging%20Technologies%20for%20Chiplets%20and%203D_0819%20publish_public.pdf
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