For those of you that are curious about the PDKs mentioned by Dr Lebby during the ASM, here is an exchange during an Intel presentation last week that shows how the whole foundry industry is moving in this direction (I called them functional Lego blocs to design the chips, here Mr. Bryant calls them tiles…), and how Dr Lebby places Lightwave Logic at the forefront of the driving trends in the industry (Transcripts found on Seeking Alph.) :
Intel Corporation (NASDAQ:INTC) Evercore ISI Inaugural TMT Conference Call June 9, 2021 4:00 PM ET
Company Participants
Gregory Bryant - Executive Vice President, General Manager of Client Computing Group
Ben Thom - Senior Director of Investor Relations
Conference Call Participants
Christopher Muse - Evercore ISI Institutional Equities
(…)
Christopher Muse
Got you. Curious around advanced packaging. I think one of the areas that is underappreciated about Intel is good leadership there. I’m curious how does it fit into your roadmap? I guess, in my mind, I can’t think intuitively more fill around data center AI, less so PCs, but I'm probably wrong. So if you could kind of walk through how you're thinking about using advanced packaging to differentiate your solutions at?
Gregory Bryant
All what I can say, and I don't want to give away too many details, C.J. on a future roadmap. But what it enables us to do increasingly and you'll see it as we go from Alder Lake, the future generations on our roadmap. We've talked about in our architectural forums this notion of being able to disaggregate and leverage the right IP on the right process technology with the right cost structure, the right performance and power structure, and put them all together now and what we would call system on a package versus what I might have traditionally been called system on a chip, and I'm going to leverage that very, very heavily.
So you could imagine us having a compute tile, high-performance compute tile on a node optimized for that, like Intel 7-nanometer or future technologies. You could imagine us having a different graphics tile, which now instead of kind of like traditional integrated graphics in the CPU complex could be a very beefy graphics compute tile, right, optimized for density and performance and power that now gets stitched together inside the package.
So I think this is going to give us the flexibility with kind of a base, think of it as one common architecture that we can then scale through these different tiles and our advanced packaging to service different segments. And I think that's really going to be an advantage for us because this business, it's not – the PC business, and I know you're close enough to it to know it's not one-size-fits all. I mean, part of the strength of Intel is the choice. The platform optimization that we do to meet customer's needs, we've got the broadest portfolio on the market. This is going to help us even be more tailored to those segment needs. And I think it's going to be a real competitive advantage for us versus what our competitors can do.
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I hope this shows how this move by LWLG opens doors in the whole foundry ecosystem: "The foundries are HUNGRY"
GLTAL,
AR.
