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Re: Gamesc post# 195934

Thursday, 07/30/2020 4:24:26 PM

Thursday, July 30, 2020 4:24:26 PM

Post# of 232823
This says AIP will be integrated into the "internal BMG subframe".

I will boldly predict sophisticated audio "groove and tunnel" will be all part of unibody BMG subframe. Yes, there is an Audio IP within the CIP.

LESS (assembly) creates MORE (volume space).....hence thinner overall.

Thin and flat (vertical and horizontal) allows much bigger "screen to body" ratio.

Thin will allow absorption of height increase from bumper case.

Bumper case will protect all "glass gate"

This video tells it all.


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