Lightwave Logic Inc (LWLG)

[prototype_101]

We attended the technical OFC Conference in San Diego in March. The main takeaway is that people have started talking more openly the market gaps that we are targeting: runaway power consumption, a speed roadmap that runs out shortly, unceasing demand for more bandwidth, and miniaturization. New at OFC this year is a more widespread belief that photonics will have to be “copackaged” with electronics in a multi-chip-module style technology platform. This trend perfectly fits in the application and design of high performance electro-optic polymers. We left the conference excited with the possibilities of further opportunities for our polymer technology. furthermore, we see customer trends towards greater density and miniaturization of electronics chips than optical chips, and we believe
this is a very favorable direction for photonic integrated circuit (PIC) platforms which shrink the size of the optics.

https://b2icontent.irpass.com/2252/177075.pdf

ASM Q&A at about 1:01:01 Dr Lebby talks about how LWLG's technology is perfectly positioned for the Photonics Industry's rapid trend towards CO-PACKAGING

Listen to what Dr Lebby's said, "co-packaging is where you bring the optics right next to the electronic chip, the CMOS chip, in fact, you put it actually on the chip, so you want to make that inter-connect as short as you can, so that the interaction between the electronics and the photonics is as close as possible, and if you think about our technology for a second, we've got a spin-on polymer technology that you can spin on to IC's and CMOS, so we are ideally positioned to harness the co-packaging trend that is occurring, so yes, I am watching the competition in terms of the materials and the performance of the devices, but we're also watching how it gets packaged together, and we are actually ideally positioned for this new trend that's just occurring where other technologies are going to suffer, and so yes it's not just the materials, it's not just the device's but you have to look at the packaging too, and you have to look at where all the fronts are, and where the technologies are progressing and at what rate, and the conclusion is that mother nature is working with us on a number of different fronts, and that's really really exciting!"