Poet Technologies Inc (POET)

[prototype_101]

POETF extends the era of “More than Moore” with POET’s Optical Interposer Platform, which facilitates the co-packaging of electronics and optics in a single Multi-Chip Module (MCM). Simply put, Optical Interposers pave the way for “Photonics-in-a-package” Based on its Dielectric Waveguide technology, POET’s Optical Interposer provides the ability to run electrical and optical interconnections in a common interconnect fabric on the same interposer chip at a micrometer scale. Hybrid Integrated Photonics Packaging (HiPP) enabled by the Optical Interposer plays a critical role in improving electrical and thermal performance, power consumption and form factor of the photonics sub-assemblies. The optical interposer currently forms an integral part of POET’s hybrid integrated optical engines and leverages the manufacturing processes and unique capabilities of its dielectric waveguides.

Suresh's Presentation at upcoming China International Semiconductor Executive Summit

http://chinasemiconsummit.com/session/suresh-venkatesan-ceo-poet-technologies-topic-chip-scale-assembly-for-photonic-optical-engines-using-the-poet-opticalinterposertm/