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Saturday, 06/30/2018 12:37:40 PM

Saturday, June 30, 2018 12:37:40 PM

Post# of 195213
I know the optimized 50Gbs modulator packaged proto seems to be the only focus investors have in mind currently, and while yes this will open the door to a $300-$400 million market on its own, the fact is that this is really only a stepping stone to the next chapter, the P2IC Platform development of PIC's using the 50Gbs modualtor, so I wonder how much effort is currently being focused on the PIC developments, it almost seems that overcoming the parasitics between the modulator and standard packaging may not be worth the effort when stopping to consider the fact that the PIC market for ROSA/TOSA Optical Engines is currently well over 10 times the market size, and I don't believe the parasitics will be at issue when the hermetic seal is done at the wafer level, would appreciate thoughts on this from our more technical savvy posters, Rick, Richard, Photonics Guy, etc, tia

Role of polymers will accelerate quickly (slide 53)

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