Can you get anything from the job openings and description that they have on the website:
(1) PIC Design and Fabrication Engineer
Lightwave Logic (LWLG) is a public material and device development company that is commercializing its leading Organic Nonlinear Polymers for a variety of electro-optic devices that will be part of our polymer PIC platform. The primary applications for our polymer PIC platform will in high-speed fiber-optic telecom and data communications. Our development roadmap is focuses on addressing 100Gbps opportunities using 25Gbps polymer modulators, and 400Gbps opportunities using 50Gbps modulators. Our materials and devices are extendable into other applications, including sensing, IoT, defense, and consumer markets. We are seeking a Photonic Integrated Circuit (PIC) design engineer to work in our facility in Longmont, CO. Lightwave offers competitive compensation and benefits along with a fast-paced working environment.
Lightwave Logic is seeking an experienced PIC engineer with either III-V compound semiconductor and/or Silicon Photonics experience to enhance the company’s activities in developing our polymer PIC platform. This position requires hands-on experience in the design of PIC circuits (using at least typical commercial software tools), and demonstrated fabrication and testing of the PIC circuits. Experience in data rates above 10Gbps would be needed. The successful candidate will play a key role in the design, development, and qualification of our polymer PIC platform.
Specific duties will include:
•Design and modeling of PIC platform and the associated active and passive devices
•Familiarity of III-V compound semiconductors and silicon based material systems
•Fabrication and testing of PICs with associated statistical analysis of results and performance
•Design of polymers and key characteristics
•Basic optical high speed characterization skills e.g. optical loss, optical modal properties and other passive/active characteristics of electro-optical polymer devices as well as inorganic III-V and silicon devices.
•Designing devices from low frequencies to multi-GHz (10-100 GHz) to be integrated onto our polymer PIC platform.
