Lam Research to buy Novellus Systems for $3.3 billion
Noel Randewich and Himank S
Looks like a more than one link to me...not to mention the Dr
Tsali Cross
Advanced Manufacturing
Portland, OregonSemiconductors
Current
Lam Research
Previous
Neah Power Systems, Inc., U.S. Department of Energy, Intel
Education
University of Colorado Boulder
Sr. Test Engineer
Lam Research
February 2014 – Present (3 years 7 months)
-Test Continuous Improvement and process definition
-Specification and transition to HVM
-SPC development and leadership
-PECVD, Direct Metals, Wafer Handling, Spin Clean, ALD, Plasma Strip
John Drewery
Principal Technologist at Lam Research
Experience
Lam Research
Senior Director, Technical
Company Name Lam Research
Dates EmployedMay 2010 – Present Employment Duration7 yrs 4 mos
Develop new process technologies in conductor etch.
Novellus Systems Inc.
Senior Director, Advanced Technology
Company Name Novellus Systems Inc.
Dates EmployedJan 2001 – Dec 2009 Employment Duration9 yrs
2001-2005: Managed projects in corporate R&D center evaluating technologies for introduction in the 5 years distant time frame. Advanced programs in metals deposition by CVD, ALD and PVD; metal removal via CMP. Managed process and engineering development. 2007-: Developing process and hardware for new dielectric applications
Neah Power Systems, Inc.
Executive VP, Engineering
Company Name Neah Power Systems, Inc.
Dates EmployedJun 2005 – Aug 2007 Employment Duration2 yrs 3 mos
Seconded from Novellus to Neah at request of Neah board. Developed outsourced manufacturing techniques for a novel fuel cell allowing company to advance from benchtop to manufacturable fuel cell components. Located and worked with vendors worldwide to establish manufacturing chain allowing full production outsourcing. Focussed research efforts on delivering a demonstratable product. Invented and implemented a key component of the fuel cell.
Chris D'Couto
President and CEO, Neah Power Systems
Novellus Systems
Director
Company NameNovellus Systems
Dates EmployedNov 2003 – Jan 2006 Employment Duration2 yrs 3 mos
* Revenue and customer management of second largest product with key logic customer
* Strong financial skills for effective product management and business development
* Negotiated two collaboration agreements with largest logic manufacturer that led to effective product introductions.
* Introduced new products, and managed beta sites for successful introduction of new technologies
* Published technical papers with key customers
Novellus Systems
Sr. Manager
Company NameNovellus Systems
Dates EmployedSep 2000 – Oct 2001 Employment Duration1 yr 2 mos
* Managed team of Key Account Technologists to support and strengthen product position at Top 10 customers
* Managed beta sites associated with introduction of new products
(Reuters) - Lam Research Corp (LRCX.O), a supplier of wafer fabrication equipment, agreed to buy smaller rival Novellus Systems Inc NVLS.O for $3.3 billion in stock as it looks to gain cutting-edge technology and become more efficient.
The deal is the latest acquisition in the semiconductor industry as manufacturers and chip-gear makers wrestle with cutthroat competition, waning PC sales growth and a weak economy.
Under agreement's terms, Novellus stockholders will receive 1.125 shares of Lam Research common stock for each Novellus share held, or a 28 percent premium to the stock's close on Wednesday on Nasdaq.
"If you look at the current environment, there's lots of uncertainty. If anything this deal comes at a good time because it's at an inflection point for the next upturn," said Stifel Nicolaus analyst Patrick Ho.
Ho said that at 2.3 times 12-month sales, Lam is paying a reasonable price for Novellus and much less than the 4.5 times that leading chip-gear maker Applied Materials paid for Variant earlier this year.
Lam's leadership in etch and single-wafer clean equipment aligns with Novellus' specialization in thin-film deposition and surface preparation technologies, the two companies said in a statement.
The combined company will be well-positioned to lead the industry through critical technology transitions including 3D structures in advanced logic and NAND memory as well as the scaling to 450 millimeter wafers, they said.
