Liquidmetal Technologies Inc (LQMT)

[Gamesc]

Corning abandoned this application in July 2016. Same USPTO application I shared with this board when it came out.

The other application I shared that met the same fate was one from St. Gobain, which they abandoned in June of this year.

http://www.freepatentsonline.com/y2015/0183179.html

In its claims/descriptions:


"The transparent body 22, whether in the form of a single layer or a composite, can be a finished product. In another embodiment, a bezel or frame can be formed or placed around the transparent body 22 after a defect in the transparent body has been filled. In an embodiment, an injection molding technique can be use to form the frame. The transparent body 22 can be placed into a mould for injection molding. In a particular embodiment, liquid or molten metal can be injected into the mould and fill a cavity in the mould that is not occupied by the transparent body 22. The metal can be an alloy. In a more particular embodiment, the metal can be Liquidmetal Alloy™ (Liquidmetal Technologies of Rancho Santa Margarita, Calif., USA). In another embodiment, a thermoset or thermoplastic resin may be injected instead of the metal. In a further embodiment, a metal bezel or frame can be placed around the transparent body 22, and a thermoset or thermoplastic resin may be injected to fill a void between the metal bezel or frame and the transparent body 22."

DMN:

Bonding/joining patented belonging to CIP:

http://www.freepatentsonline.com/y2003/0024616.html

http://www.freepatentsonline.com/y2011/0162795.html