Liquidmetal Technologies Inc (LQMT)

[joshuaeyu]

Imagine phone casing itself is also the PCB substrate.

All silicon die (instead of chip) will be bonded there. BMG has the sub micron precision to bond those miniscure size die with submicron die bump.

The BMG casing itself can easily be isolated into regions so that RF die will be separated from power hungry digital die. RF device will also have no need for external antenna since it is mounted on a RF transparent substrate.

BMG is also the best thermo conductor (heat sink) that is not electrically conductive. Look for your future BMG phone to be a bit toasty.

Li bought LED company for that same reason. While LED last forever, it has always been the integrated power supply that burnt out without efficient heat dissipation.

This frees up all the internal space to allow big size battery to fit in.

Sorry to bore most folks here.