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Re: borusa post# 10590

Wednesday, 08/06/2003 11:34:30 AM

Wednesday, August 06, 2003 11:34:30 AM

Post# of 97814
borusa - My guess is that when Intel processes a wafer defects are not exclusively random. I can further speculate that the ratio of yeild to wafer size is not liniar.

Not exclusively that's for sure but over time and large volumes that's the best model to use. BTW there is reason to think that 300mm defect density will be lower than 200mm. A large number of the particulates come from the equipment, so more or less the same number of equipment related particles will fall on both wafers.
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