Liquidmetal Technologies Inc (LQMT)

[Dell_Griffith]

Wow!

Background technique

At present, such as mobile phones, tablet PCs and other electronic equipment borders gradually using alloy material from processing, metal alloy frame made of metal not only has a good aesthetics, but also to protect the electronic equipment fragile panel or backplane. Traditionally, panels, backplanes, or plastic components of electronic products are embedded in a machined metal frame, and the metal frame is then assembled with the corresponding components. This method combines the metal frame with the electronics panel, There is a certain gap between the assembly, even through the precise control of product processing accuracy, the assembly gap will still exist in electronic products.

In addition, the above-mentioned patent CN 101815594 only refers to the combination of a transparent member such as glass and sapphire with a metal material, and transparent materials such as glass and sapphire are transparent in the whole molding or MIM process, The structure of the transparent material is affected to a certain extent, thus affecting the aesthetic appearance of the electronic products.

E) rapidly cooling the semisolidized metal located at the periphery of the non-metallic member to mold the semisolidized metal into an amorphous metal bonded seamlessly to the periphery of the non-metallic member.