Advanced Micro Devices Inc (AMD)

[kpf]

CombJelly thanks

Although the article is fairly old, it could well be still accurate:

"Later, in mid-2003, the rest of Building 323, about 34,000 square feet, will be tooled up to become the development line that will continue to advance work using 300-millimeter wafers."

Considering the rest of the fab is not fully utilized already, it would make sense to leave the development line where it is now, delay tooling of the rest of the building until 2004 (if my model is anywhere near accuracy, AMD does not need new capacities before H2/2004, more probably only in 2005, depending on future SoI-Yields). 34000 sqfeet for modern automated 300mm tools, what would that be in Waferstarts for K8?
1000 per Week? Ideas anyone?

Now, if its that, it looks like an interim-solution until a new FAB (joint or not) will be going online for 65nm-node in the 2006/2007 timeframe.

Wbmws thoughts about the commercial organization of it would fit pretty well into that. As it would fit into AMDs efforts to increase the variable part of the cost structure.
For a while, that is.

K.