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http://www.intlmag.org/news/346555/IMA-Announces-2017-Award-of-Excellence-and-Environmental-Responsibility-Award-Winners.htm
They put something up on the front page of Eontec website.
http://www.e-ande.com/index.php
Li does not control the IP,read the full filings of master agreement between Liquidmetal and Eontec
No this is not about china having all the power. This was about providing josh the proof that the IP aspect of license was clear what patents/application Eontec was given license to.
I give up with you ....
Straight from SEC filing
"PATENT LICENSE GRANT AND RELATED COVENANTS
2.1. Patent License Grant to Eontec. Upon the terms and conditions set forth herein (including the termination provisions in Article 7 hereof) and subject to the Field of Use Restrictions, LMT hereby grants to Eontec a non-revocable, paid-up, royalty-free, perpetual license (or sublicense, as the case may be) to the LMT Licensed Patents and LMT Licensed Technical Information to make, have made, use, offer to sell, sell, export and import Eontec Licensed Products within the Eontec Field in the Eontec Exclusive Territory and Non-Exclusive Territories. Such license shall be exclusive to Eontec (including to the exclusion of LMT and its Affiliates) in the Eontec Exclusive Territory and shall be non-exclusive in the Non-Exclusive Territories. Notwithstanding the foregoing, nothing in this Agreement shall prohibit Eontec from engaging in research or development activities in the LMT Exclusive Territory."
Let me help you with definitions straight from there too. Focus on "Appendix A".....
"1.23. “LMT Licensed Patents” shall mean any and all Patents of LMT or any Affiliate of LMT in existence as of the Effective Date in the Eontec Exclusive Territory and Non-Exclusive Territories, including without limitation the applicable foreign counterpart patents of those U.S. Patents listed in Appendix A, and those Patents of LMT or any Affiliate thereof in the Eontec Exclusive Territory and Non-Exclusive Territories for any invention that is first created, conceived, or reduced to practice during the period beginning on the Effective Date and ending of the last day of the Joint Development Period."
Yes you were don't be coy. It's in the Liquidmetal SEC filings.
Agreed Yama on Apple iPhone comment. Maybe small part is possible or it's a wearable component.
Huh? Li doesn't own the IP...Eontec has a license to SOME IP. The IP sits in CIP, guarded by Apple.
Did you kind that just via USPTO, Apple has direct assignment or indirect assignment of almost 300 patents/applications - courtesy of Liquidmetal, Glassimetal, Materion and stuff they have filed? Biggest portfolio in the world related to BMG's - which is not even counting matching filings in other countries.
Think twice if you think Lugee wouldn't be squashed if he over reaches with them....
New job...manufacturing engineer
http://job-openings.monster.com/v2/job/View?JobID=183811741&MESCOID=1700184001001&jobPosition=18
Agree DPP, can't continue to hoard the golden goose...or else risk laying a rotten egg at one point.
It's in the public sphere but no official release.
In my hands, lots of digging and paying for documents from USPTO.
The Risk was there until Big bother Apple issued security release to CIP for 50 plus patents/applications to pave the way for the license to Eontec. When I saw Apples IP attorneys John Hancock I knew Apple had blessed Liquidmetal to allow Eontec to sit at the table.
Maybe they mean Liquidmetal will be $14.67 a share? Now that's more like it....
Maybe I'll play those numbers for my lottery ticket instead of Liquidmetal ops price.
Sure does or move to the ledge on 3rd floor....
Yes some CIP/Apple bmg applications have gone multiple rounds before finally allowed. It's crazy sometimes it boils down to one key word or phrase to make the difference in how a claim passes.
Np, I'm sure it will get granted which just have to go through several non final or final rejections before they settle on specific claims allowed. Just wanted to keep everyone updated.
Someone had posted earlier this week or last. Uses Liquidalloy from Prometaltech.
What ? Byd has the issued patent in china that the USPTO used as basis to its rejection. Who cares about alloy it's in the manufacturing process that CIP/Apple control the IP
Well Lugee's first attempt of getting this alloy patented here in the US was rejected today.
http://www.freepatentsonline.com/y2015/0322555.html
It is going to have to overcome this patent from BYD
http://www.google.com/patents/CN102080196A?cl=en
Yes just changes already made last week...
Interesting that Apple filed amendments to this USPTO application on the 11TH of MAY when this was not even under Examiner review yet and was just published on 3/30/17.
http://www.freepatentsonline.com/y2017/0088954.html
Again talking about metallic glass coating onto metal substrate..
HMMMMMMMM
Know that, but the IP held in CIP or Apple assignments have coating based embodiments/claims. Just because LM Coatings is another company doesn't preclude our LM or Apple to not use coatings..
The thought is that Apple would start with the using the full alloy, but maybe they will start using amorphous alloy coatings.
They just filed amendments to this USPTO application on the 10th.
http://www.freepatentsonline.com/y2014/0009872.html
Im more optimistic than previous years because Lugee has been on target. However, it's the $$$$ contracts that will make this move.
DMN it's just my personal expectations that's all. Not saying he's not kept his word but I'm not hanging around with another regime that doesn't deliver.
DMN it's just my personal expectations that's all. Not saying he's not kept his word but I'm not hanging around with another regime that doesn't deliver.
If lake forest is not churning decent production by early 2018 this is a dud
Yes but would be curious on lugees specific prototype on their website
Thanks for the response. Curious about the bmg/ceramic phone that Eon prototyped since they mentioned this combo in the transcript you provided.
Thanks for sharing josh. So what are your takeaways from the article/answers?
What does it say?
From 2010?
Forgot to share this week:
http://www.freepatentsonline.com/y2017/0128981.html
Subsidiary of UTC....
http://utcaerospacesystems.com/Company/Pages/company.aspx
Sonething I saved from a wile back from Corning.
http://www.freepatentsonline.com/y2015/0305145.html
"The Tg of the Vit105 BMG was measured by DSC-TGA as ˜395° C. and Tx (onset) as ˜453° C. The BMG substrate was cleaned and metalized or coated. Next, these BMG substrates were coated with Cr—Ni followed by dull-sulfamate Ni and then Au coated. Eutectic Au—Sn solder preforms were cut into the required shape and sandwiched between the BMG substrate and the semiconductor chip. This multi-layer stack was held tight with the chip and was carefully transferred to a solder reflow oven. The highest temperature in the oven was 320° C. and was cooled down to room temperature. This is because the melting point of the Au—Sn solder is 280° C. Once the bond was formed, the soldered assembly was removed from the solder reflow oven and, as a first step, a needle was poked at the chip to make sure it was strongly adhered to the substrate. Next, one of the assembled samples was loaded into the dage machine and a shear test was performed. The shear force required to shear off the chip was approximately 0.5 Kg."
Dam this Liquidmetal post made my day lol