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Right back at ya, drifting into Toms Liquidmetal past....who is Steipp btw?
Bingo!! You can add more value than the same dead horse of Steipp this or Steipp that...this is NOT Toms ship anymore.
If you had the opportunity to chat with Lugee would you waste it on Tom/James/John or would you spend it on what is today and the future?
Thanks still trying to figure out him working for Big Blue
Anyone speak Turkish? Atakan Peker
Company to keep an eye out for. Will see if claims are going to be patentable over existing IP from Liquidmetal, Apple, Glassimetal, Caltech or Exmet. Might not be an issue since they claim their tech is different than laser based 3D printing system.
http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=14&f=G&l=50&co1=AND&d=PG01&s1=%22Amorphous+alloy%22&OS=%22Amorphous+alloy%22&RS=%22Amorphous+alloy%22
8 more applications from them were published today
Amazing that Lugee was a scam and now on a pedestal...sounds familiar doesn't it to Lugees predecessor? Wait, if Lugee screws up he will be dead wood...
What makes them the same then?
We are talking about rofr not whole MTA, then again I'm not the expert at this legal Mumbo jumbo
If it wasn't mutual then amendment wouldn't have been made, right?
What's the big point of mutual you are trying to make?
They have license to it that doesn't mean own from CIP. They only own what has been created inhouse, by Their team
No there has been stuff filed since that date.
Yes of course why would it be filed. It's signed by zadesky himself.
All that states is rofr for Apple ends feb 18'
That is from May 2015 filing which established feb 2018 as end period of rofr and nothing has beeen filed since then.
Just in case folks want to know definition of ROFR:
"Right of first refusal (ROFR or RFR) is a contractual right that gives its holder the option to enter a business transaction with the owner of something, according to specified terms, before the owner is entitled to enter into that transaction with a third party."
Here is exact verbiage:
2. AMENDMENTS.
(a) Section 1(a)(v) of the MTA (as amended by the Prior Amendments) is hereby further amended by replacing “February 5, 2015” with “February 5, 2016”.
(b) Section 9(A)(a) of the MTA (which was added to the MTA pursuant to Amendment Number One) is hereby replaced by the following:
“(a) Apple’s rights under this Section 9(A) will commence February 6, 2014 and expire on February 5, 2018.”
(c) Recital A of the Contribution Agreement (as amended by the Prior Amendments) is hereby further amended by replacing “February 5, 2015” with “February 5, 2016”.
1
(d) Section 1 of the Contribution Agreement (as amended by the Prior Amendments) is hereby further amended by replacing “February 5, 2015” with “February 5, 2016”.
More of an uptick of prosecution of existing or divisional applications. Lots of fine tuning claims about saud inventions/embodiments.
Published in Europe today for Eontec
http://www.freepatentsonline.com/EP3181268A1.html
http://www.freepatentsonline.com/EP3181267A1.html
Already have been doing that for years :)
That whole tyco/covidien combo
Liquidmetal/Crucible USPTO IP update:
The following will be issued as patent#9695494 on 7/4:
http://www.freepatentsonline.com/y2017/0152586.html
The following have been allowed and are pending payment for issuance (by due date):
6/30/17
http://www.freepatentsonline.com/y2015/0107730.html
7/5/17
http://www.freepatentsonline.com/y2012/0158151.html
7/14/17
http://www.freepatentsonline.com/y2016/0091250.html
7/20/17
http://www.freepatentsonline.com/y2015/0034213.html
7/24/17
http://www.freepatentsonline.com/y2011/0163509.html
7/28/17
http://www.freepatentsonline.com/y2014/0090752.html
9/7/17
http://www.freepatentsonline.com/y2014/0150933.html
9/12/17
http://www.freepatentsonline.com/y2006/0149391.html
The following received patent issuance payment on 6/16, so waiting on official issuance # and date:
http://www.freepatentsonline.com/y2011/0162795.html
The following was just allowed last week and is pending allowance notice going out:
http://www.freepatentsonline.com/y2014/0332176.html
Liquidmetal is the brand....remember LM-105 is one of the zirconium based bmgs. There are also the Gold based and platinum based bmgs that exist through Liquidmetal, that we don't hear much of.
Otw, dam you had to bring up fried bologna lol
I hated baloney too...that stuff was lethal!!
I had forgotten about the magnesium being amorphous until Josh kept on bringing up the magnesium points. In a lot of the IP both the Engel and Eontec Machines/process reference magnesium based feedstock/alloy as being an option to process with.
Well lugees magnesium alloys are amorphous
http://www.amse.org.cn/article/2016/1006-7191/1006-7191-29-9-793.shtml
Another quite puzzling thing was that the application was done under the Liquidmetal name only and that is how assignment is made. Plus the IP counsel is Foley & Lardner LLP,not a name I have seen under the Apple/CIP attorney listings for all other USPTO applications.
Hidden today but interesting
http://www.freepatentsonline.com/y2017/0167172.html
It's the miltner Adams knife, but read and look at figures 28-31
I'm not talking about mirror finish as the article pointed out cooling rate...so if cooling is an issue why hasn't he reached out to Johnson and his Rapid capacitive discharge method ....
I hope his words are prophetic....but if it is why are they stating concerns about cooling rates, etc?
Thanks, so realistically speaking Liquidmetal (more do BMG's) is getting so much closer for prime time, but not 100%.
Lugee mentions the cooling rates and size, so wonder if they have a plan to address or are working on it already or have been. This is where he should buy out Glassimetal.....
Interesting just posted job at Apples alloy division.
http://job-openings.monster.com/Materials-Engineer-Alloys-Metals-Santa-Clara-CA-US-Apple-Inc/31/7f43c04e-d7b6-4524-ab36-be2a7312f53b
This party got my attention:
"This position within the Alloy Engineering team will participate and lead development projects related to metals, alloys, and materials that will impact future Apple products. Responsibilities will include identifying, developing, and applying new alloys and material solutions for Apple products. The candidate will have experience in applying physical metallurgy principles to materials development, preferably utilizing integrated computational materials engineering and system engineering approaches to alloy design. An understanding of materials processing and manufacturing is also important for this position. Experience with a variety of ferrous, non-ferrous, and reactive metal alloys to assist designers in materials selection for cosmetic, mechanical, and other performance metrics is essential. The successful candidate must posses the ability to manage multiple projects simultaneously with competing priorities.
A minimum of M.S. in Materials Science, Metallurgy or a related field is required5+ years of experience with leading large alloy development and materials processing-related projectsBackground in materials selection and application of materials in product designThermo-mechanical processing and heat treatment of metals and alloysExperience utilizing integrated computational materials engineering approaches for alloy design is highly desirableExperience with aluminum alloys and anodizing is highly desirableExperience with stainless steels and other metals is also highly desirableFlexibility and comfort working in a fast-paced environment"
This small excerpt:
"Thermo-mechanical processing and heat treatment of metals and alloys"
Bulk metallic glass is processed via thermomechanical process.
Forgot to share Big Blues application this week:
http://www.freepatentsonline.com/y2017/0164521.html
"Amorphous liquid 180 can take the form of any amorphous metal alloy that is characterized with high elasticity in order to facilitate the travel of magnet 185 within column 170, and thus maximize power generation from dynamos 165 due to energy arising from wave motion in water 120. Other properties that amorphous liquid 180 can have include high strength to reduce fractures so that it can continually store the kinetic energy and be non-magnetic in order to function with magnet 185. LIQUIDMETAL and VITRELOY are commercially available amorphous liquids that are suitable for use with dynamos 165. It is understood that these amorphous liquids are only examples, and are not meant to limit the scope of the various embodiments described herein."
Agreed!
And Apples patent application for bmg bezel.
http://www.freepatentsonline.com/y2015/0121677.html
"Display 16 may be a liquid crystal display (LCD), an organic light emitting diode (OLED) display, or any other suitable display. The outermost surface of display 16 may be formed from one or more plastic or glass layers. If desired, touch screen functionality may be integrated into display 16 or may be provided using a separate touch pad device. An advantage of integrating a touch screen into display 16 to make display 16 touch sensitive is that this type of arrangement can save space and reduce visual clutter."
Ok I'll done :)
See the Matching claims/descriptions on this one?
http://www.freepatentsonline.com/y2017/0087626.html
"In one embodiment, a portable electronic device can include a cover sheet and an enclosure or housing made of the BMG formed parts described herein. The cover sheet can be composed of a polished glass, sapphire or other hardened transparent material. The housing and cover sheet come together to form an interior volume configured to enclose the various electronic components of the device. For example, the housing may define an opening in which a display is positioned. The cover sheet is positioned over the display and forms a portion of the exterior of the device. The display may include a liquid crystal device (LCD), or organic light-emitting diode (OLED) display, or other suitable display elements or components."
Here's another one of my recent favorites:
http://www.freepatentsonline.com/y2017/0087804.html
"BMG feedstock provides the high strength and longevity of an amorphous alloy to a thickness useable in a housing, for example, of an electronic device. Housings composed of a BMG-laminate can form enclosures with a glass article. The cover sheet can be sapphire, polished glass or other like material. The enclosure formed by the BMG-laminate and cover sheet can form an interior volume that is configured to enclose various electronic components of electronic device. The BMG-laminate may define an opening in which a display is positioned. The display may include a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, or other suitable display elements of components. In some embodiments, the BMG-laminate is fabricated in a near-to-net shape to the desired contour of the exterior surface of the electronic device.
Examples
Example 1: BMG-Carbon Weave Laminate
FIGS. 7A-D shows a BMG-carbon weave fabricated in accordance with an embodiment herein. FIG. 7A shows a top view of a fabricated BMG-carbon weave 700. Note the carbon fiber weave is embedded between two thin layers of BMG. The carbon fiber plain weave pattern 702 can be seen by the naked eye. In order to illustrate the laminate nature of the BMG-carbon weave, the fiber carbon weave layer 704 was made larger than the top and bottom BMG layers 706. As shown in FIG. 7B, the larger area carbon fiber weave 704 sticks out from between the two thermoplastically deformed BMG layers 706. FIG. 7C provides a perspective top view of the BMG-carbon weave laminate consisting of one carbon fiber weave layer sandwiched between two BMG plates. The two BMG plates bond to each through the carbon fiber weave layer to provide the significantly improved laminate strength parameters. Finally FIG. 7D shows a single BMG layer 706 thermoplastically formed into a carbon fiber layer 604 to illustrate the flow of the BMG in between the fibers (arrow 708) during laminate forming.
Example 1 illustrates the significant improvement of BMG-fiber laminates over other metal-laminates in the manner by which the fiber weave is mechanically embedded in the BMG. Conventional metal-laminates require adhesives and chemical bonding to form the laminate, an inferior bonding to embodiments described herein.
Example 2: BMG-Carbon Weave Fabrication
FIGS. 8A-F show the fabrication of a BMG-carbon fiber weave in accordance with embodiments herein. Various size fibers or fiber weaves can be used to prepare BMG-fiber laminates, the size typically determined by the required size of the feedstock. FIG. 8A shows a 1.5?×1.5? piece of dry carbon fiber 800 suitable as the fiber layer in a BMG-fiber laminate as does FIG. 8B, which shows a 3?×3? piece of dry carbon fiber 802. FIG. 8C shows the positioning of the 1.5?×1.5? fiber 800 on a thin sheet of 1.77?×1.77? BMG 804. In this embodiment the thin BMG sheet provides an overlap which during formation with a second 1.77? sheet would fully encapsulate the 1.5? fiber layer (see FIG. 8E). FIG. 8D shows the alternative where a 3?×3? piece of fiber 802 is positioned between two 1.77? thin BMG sheets. Finally, FIG. 8F shows a hot forming set-up 806 for fabrication of one embodiment of the BMG-laminate embodiments as described herein.
Example 2 shows the utility of making feedstock BMG-fiber laminates using carbon fiber weaves and pre-formed thin BMG sheets.
Example 3: Hot Formed and Quenched BMG-Carbon Fiber Laminates
FIG. 9 provides views of the two laminates fabricated in Example 2. The top panel shows the hot formed, fully encapsulated, 1.77?×1.77? BMG/1.5?×1.5? fiber weave laminate 900. The bottom panel shows the hot formed, 1.77?×1.77? BMG/3.0?×3.0? fiber weave laminate 902. The hot formed and quenched laminates, as shown in FIG. 9, show the BMG thermoplastically formed in and around and through the carbon weave layer, again showing the utility of mechanical bonding over chemically bonding. The BMG-carbon fiber laminates were quenched at an appropriate temperature.
The foregoing description, for purposes of explanation, used specific nomenclature to provide a thorough understanding of the described embodiments. However, it will be apparent to one skilled in the art that the specific details are not required in order to practice the described embodiments. Thus, the foregoing descriptions of the specific embodiments described herein are presented for purposes of illustration and description. They are not targeted to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to one of ordinary skill in the art that many modifications and variations are possible in view of the above teachings."
Let's make people happy with the Oled option. :)
http://www.freepatentsonline.com/y2017/0090515.html
In one embodiment, a portable electronic device can include a cover sheet and an enclosure or housing made of the BMG feedstock or composite feedstock described herein. The cover sheet can be composed of a polished glass, sapphire or other hardened transparent material. The housing and cover sheet come together to form an interior volume configured to enclose the various electronic components of the device. For example, the housing may define an opening in which a display is positioned. The cover sheet is positioned over the display and forms a portion of the exterior of the device. The display may include a liquid crystal device (LCD), or organic light-emitting diode (OLED) display, or other suitable display elements or components.
Thanks my reply was not based if they were or not supplying. Was based on contract/agreement existing or not.