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Issued as patent to CIP/apple today by USPTO:
http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=4&f=G&l=50&co1=AND&d=PTXT&s1=%22Amorphous+alloy%22&OS=%22Amorphous+alloy%22&RS=%22Amorphous+alloy%22
Issued to Apple
http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=5&f=G&l=50&co1=AND&d=PTXT&s1=%22Amorphous+alloy%22&OS=%22Amorphous+alloy%22&RS=%22Amorphous+alloy%22
Who cares about Eontec stock on a Liquidmetal board.....is my biggest point.
WOW GOOD GRIEF from the previous close of 8.93, a WHOPPING 0.22% slide!!!!
Smh ....
How do you take seriously if the writer can’t even get the location of Liquidmetal right?!
Last week I noticed that there was some POA (Power of Attorney Changes) to some current USPTO applications under CIP. Here is one sample:
http://www.freepatentsonline.com/y2015/0289605.html
The new IP attorneys hired by Apple to handle this and others is:
https://www.dorsey.com/
The last time this happened was when there was in 2016 (if memory serves me correctly), when the Right of first refusal was extended to 2018, and was moved to Brownstein Hyatt Farber Schreck.
Don't read into this, its just an observation right now, that I happened to notice in looking at filings.
This was granted to Apple today:
http://www.freepatentsonline.com/9986668.html
"Snap 215 may extend either from flange 214 (as shown) or directly from housing 201 in embodiments in which flange 214 is absent (see, e.g., FIG. 3A showing snap 331 extending outwards from housing 311). Snap 215 may be designed to engage retaining feature 217. Retaining feature 217 may take the form of, for example, an indentation, channel, or other receiving feature formed in inner surface 219 of housing 203 (as shown). In a preferred embodiment, snap 215 may form an integral part of housing 201 and be formed of the same material and as part of the same manufacturing process as housing 201. Retaining feature 217 may similarly form an integral part of housing 203 and be formed of the same material and as part of the same manufacturing process as housing 203. Snap 215 and feature 217 may be formed from any suitable material that allows snap 215 and/or feature 217 to be elastically deformed when housing 201 is inserted into housing 203. In particular, snap 215 and feature 217 may be formed of an elastic material, i.e. a material with high elasticity which allows snap 215 and/or feature 217 to bend or deform without yielding when a force is applied to them, and to regain their shapes once the force is removed. For example, snap 215 and feature 217 may be formed of an amorphous metal alloy having a high elasticity and an ability to bend without yielding (e.g., liquidmetal, vitreloy, metallic glasses). In embodiments in which both snap 215 and feature 217 are made of elastic materials, snap 215 and feature 217 may be deformed by substantially the same amount (measured as, e.g., the same distance from the snap's or the feature's rest position, or the same distance from their positions when the housings are coupled) when housing 201 is inserted into housing 203. In some embodiments, snap 215 and/or feature 217 may remain deformed while housings 201 and 203 are secured to each other. In other embodiments, snap 215 and/or feature 217 may only be deformed while housing 201 is being inserted into housing 203."
Next up on 6/12, will be issued to CIP:
http://www.freepatentsonline.com/y2014/0293384.html
http://www.freepatentsonline.com/y2015/0299824.html
The following have been granted patent allowance and are pending fee remittance for CIP:
http://www.freepatentsonline.com/y2015/0306670.html
http://www.freepatentsonline.com/y2013/0340897.html
http://www.freepatentsonline.com/y2014/0202597.html
The following have been granted patent allowance and are pending fee remittance for Apple:
http://www.freepatentsonline.com/y2016/0313703.html
http://www.freepatentsonline.com/y2016/0024630.html
http://www.freepatentsonline.com/y2015/0315687.html
First one belongs to CIP and second one is All apple
Issued today by uspto
http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=4&f=G&l=50&co1=AND&d=PTXT&s1=%22Amorphous+alloy%22&OS=%22Amorphous+alloy%22&RS=%22Amorphous+alloy%22
http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=3&f=G&l=50&co1=AND&d=PTXT&s1=%22Amorphous+alloy%22&OS=%22Amorphous+alloy%22&RS=%22Amorphous+alloy%22
It’s additive manufacturing not amorphous metals
Maybe they’re just doing what they said they would do from August 2017 8k
“Mr. Van receives a base annual salary of $210,000 and is eligible for future discretionary bonuses and equity grants under the Company’s equity incentive plan. Mr. Van does not have a written employment agreement with the Company.”
You are a select exemption Paraclete ... you’ve got serious skin in the game unlike some folks around this joint
Not sure what laws or ethics laws he’s violating...it’s funny how people turn on someone who invested $64 million and was considered the second coming of sliced bread.
Unless you own 405 million shares like Lugee, you and I ride on someone’s else coat tail.....
Can’t help you then with the personal problem ....
Two publications one in china and one via WIPO
Yes unnamed .... probably Visser
Are these things really accurate how they pull their data ?
Cirrus logic and amorphous metal
http://www.freepatentsonline.com/y2018/0124484.html
Provisional application filed in 2013
Otw they’re fine tuning claims and part of it is to fine tune portions that could infringe on existing IP. The amorphous bezel is almost close to final stages based on its history
Apple filed changes/amendments to this application on 4/26/18, and continues to reference amorphous metals as possible choice for this product.
http://www.freepatentsonline.com/y2017/0336831.html
Apple filed an amendment on 4/30/18 with USPTO to this application:
http://www.freepatentsonline.com/y2015/0121677.html
In essence only keeping Claims #1-12
Funny you mention this....Apple IP attorneys filed changes on April 26th to the uspto version. The application Belongs to CIP.
Well Samsung and their version
http://www.freepatentsonline.com/9952622.html
“
According to various example embodiments, the first bezel 310 and/or the second bezel 320 can be formed of aluminum, stainless, amorphous metal alloy, etc.”
Nope but they did have this one
http://www.freepatentsonline.com/9949537.html
“
The latching link 202-1 includes a body 206. The body 206 may be formed from any suitable material, including but not limited to metal, amorphous metal/metallic alloys, ceramic, and plastic.”
“2 years later we are halted at $9.00 ...” who the heck is “we”? You own shares in Eontec. If you go back in Eontec filings back to even 2016, they talk about capital investment and how they have major investors waiting. I had forgotten about this most of the day. How I’ve translated documents these past several years and that was a common theme. Eontec knows they need capital for their plans which they had already disclosed. Like i did take the time to read the docs. They have been building their infrastructure these past years so increase in shares will drive SP down. I’m sure you are well aware of that impact.
Updated design guide
https://www.liquidmetal.com/info-center/
It’s paid you .24 plus cents so far, that’s not a fantasy...
We can always fantasize can’t we?
Flex electronics is a possibility to your idea...not Apple
I’ll take it over the cold...
http://www.freepatentsonline.com/y2018/0103557.html
“The frame component 206 can be formed from any suitable metal or non-metal material including, but not limited to, metals such as aluminum, stainless steel, gold, rose gold, platinum, titanium, amorphous metal alloys, and so on; non-metals such as plastic, wood, leather, nylon, polymeric materials, plastics, ceramics, glass, and so on. In some examples, the frame component 206 is formed by bonding multiple elements to one another whereas in other examples, the frame component 206 has a unitary construction. In some embodiments, the frame component 206 may not be required.”
“Similarly, the outer cover 208 can be formed from any suitable metal or non-metal material including but not limited to metals such as aluminum, stainless steel, gold, rose gold, platinum, titanium, amorphous metal alloys, and so on; non-metals such as plastic, wood, leather, nylon, polymeric materials, plastics, ceramics, glass, and so on. In some examples, the outer cover 208 is formed by bonding multiple elements to one another whereas in other examples, the outer cover 208 has a unitary construction. In a typical embodiment, the outer cover 208 is formed from one or more layers of strengthened or hardened glass. In these cases and other embodiments, the outer cover 208 can be referred to as a glass layer.”
Feel? I know..at least between Apple and Liquidmetal
Issued to Materion today by uspto
As you know Yurko is at Apple now...
http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=2&f=G&l=50&co1=AND&d=PTXT&s1=%22Metallic+glass%22&OS=%22Metallic+glass%22&RS=%22Metallic+glass%22