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Microsemi Corporation (MSCC)

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Headquarters 2381 Morse Avenue Irvine, CA 92614 Phone: 949-221-7100 Fax: 014-557-5989 www.microsemi.com Profile Microsemi Corporation designs, manufactures, and markets analog and mixed-signal integrated circuits (ICs) and semiconductors. Its semiconductors manage and control or regulate power, protect against transient voltage spikes, and transmit, receive, and amplify signals. The company's IC products offer light, sound, and power management for notebook computers, data storage, wireless LAN, LCD back lighting, LCD TVs, LCD monitors, automobiles, telecommunications, test instruments, defense and aerospace equipment, high-quality sound reproduction, and data transfer equipment. Its individual component semiconductor products include silicon rectifiers, zener diodes, low leakage and high voltage diodes, temperature compensated zener diodes, transistors, subminiature high power transient suppressor diodes, and pin diodes for use in magnetic resonance imaging machines. The company also manufactures semiconductors for commercial applications, such as automatic surge protectors and transient suppressor diodes for telephone applications; and switching diodes for computer systems. It sells its products through electronic component sales representatives and own sales force to original equipment manufacturers. The company serves various markets, including defense, commercial air/space, industrial/semicap, medical, mobile connectivity and notebooks, monitors, and LCD televisions in the United States, Europe, and Asia. Microsemi Corporation was founded in 1960. It was formerly known as Microsemiconductor Corporation and changed its name to Microsemi Corporation in 1983. The company is headquartered in Irvine, California. Governance Microsemi Corp.'s Corporate Governance Quotient (CGQ®) as of 18-Mar-08 is better than 92.1% of S&P 600 companies and 95.3% of Semiconductors & Semiconductor Equipment companies. Officers Mr. James J. Peterson, 52 Chief Exec. Officer, Pres Mr. David R. Sonksen, 62 Chief Financial Officer, Exec. VP and Sec. Mr. Ralph Brandi, 64 Chief Operating Officer and Exec. VP Mr. Steven G. Litchfield, 38 Exec. VP-Analog Mixed Signal Group Mr. James H. Gentile, 52 Sr. VP of Worldwide Sales Exchange NASDAQ Ownership Shares Outstanding: 78.19M Float: 77.64M % Held by Insiders: 0.62% % Held by Institutions: 121.00% Major shareholders Wells Fargo, Lord Abbett, Columbia Wanger, Franklin etc. http://finance.yahoo.com/q/mh?s=MSCC Other information Sector: Technology Industry: Semiconductor - Integrated Circuits Full Time Employees: 2,300 Financial considerations Total Cash: 105.26M Total Cash Per Share: 1.346 Total Debt: 0 Book Value Per Share: 7.546 Operating Cash Flow: 27.90M Levered Free Cash Flow: 12.57M Stock price Microsemi in Ireland 2005 by Gerry McInerney Microsemi Ireland has pulled the plug on its Ennis based manufacturing operation with the loss of 131 manufacturing jobs between permanent and temporary staff. The company has promised a generous redundancy package and outplacement services for those being made redundant. The jobs - 44 permanent and 87 temporary - will be phased out over a 12 to 18 months period. However, the company’s European sales and marketing team of 15 staff, who are based at the Gort Road Industrial Estate, will not be affected by the decision. The closure of the Ennis facility follows a corporate decision to consolidate production in their US facilities in Scottsdale, Arizona and Lawrence, Massachusetts where both have surplus production capacity. Microsemi Ireland, a subsidiary of the Microsemi Corporation which has its HQ at Irvine, California, set up in Ennis in1992 when the group acquired the former Unitrode facility. A non-union workplace, at it’s peak the company employed up on 200 people but shed 42 jobs back in July, 2002. Microsemi Ireland General Manager, Richard Finn said, “the closure of the Irish manufacturing operation is necessary in order to maximise economy of manufacturing scale for the overall Microsemi Group. The company regrets having to take this decision, which is necessary for the group’s world-wide manufacturing strategy and the ongoing competitiveness of our business.” “The company wishes to acknowledge the performance, co-operation and commitment of the Ennis employees. The decision to absorb Irish manufacturing into the US where there is surplus capacity, in no way reflects on their performance”. Mr Finn added. Microsemi Corporation employs just over 1,400 staff world-wide with an annual turnover of approximately $300 million and is a leading designer, manufacturer and marketer of analog, mixed signal and discreet semiconductors. http://www.clarechampion.ie/clch/www/index.asp?magpage=1&issid=38&issdate=Friday%2C+8+April+2005&issarch=1&topcatid=100&catid=105&id=4639 King Capital Investment Group http://kingcapital.tripod.com News Microsemi Announces New 1.7KW RF Generator Reference Design Kit Prime Newswire May 06, 2008: 08:30 AM EST IRVINE, Calif., May 6, 2008 (PRIME NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high performance analog/mixed signal integrated circuits and high reliability semiconductors, has announced a 1.7KW, Push Pull, Class-D reference design kit that enables RF design engineers to immediately evaluate a highly efficient, high power, Class-D amplifier. Based on Microsemi's DRF1300 Driver/MOSFET hybrid, the new reference design kit provides an essential tool in developing high-power, high-voltage RF generators, optimizing efficiency and power densities for plasma generation, switch mode power amplifiers, pulse generators, ultrasound transducer drivers and acoustical optical modulators. KEY FEATURES * Greater than 1700 Watts Output Power * Better than 80% Efficient Class-D Operation * 13.56 MHz Switching Frequency * Up to 250 Supply Voltages * Internal MOSFET Rated at 500V BV(DSS) * Low Cost System Design * Solid State Transition for Tube Amplifiers Class-D amplifiers offer a degree of efficiency unavailable with linear designs. Many engineers, however, avoid the complexities of Class-D amplifier designs -- or are forced to spend months acquiring its fundamentals. Now, with Microsemi's new DRF1300/Class-D reference design kit, engineers can rapidly overcome the pitfalls of high voltage Class-D design, saving months of designer time and countless design iterations. Using Microsemi's DRF1300 Driver/MOSFET hybrid as its core, the kit's reference board enables performance levels previously unachievable with solid state Class-D amplifiers. The DRF1300 hybrid combines two drivers, two high voltage MOSFETs and internal bypass capacitors in a push pull configuration making it a highly efficient, high voltage, cost effective solution. The drivers combined with optimally located bypass capacitors are capable of driving the high voltage MOSFETs at more than 30MHz. The 500V MOSFET enables high voltage applications, greatly simplifying output matching and reducing complexity of the output combining networks. The new Microsemi Class-D reference design kit includes a designer's application note discussing the progression through various output voltages, while identifying proper output waveforms necessary for safe transition to greater than 1700 watts into a 50 Ohm load. It also demonstrates how to achieve efficiencies higher than 90% at sub 1KW outputs. It demonstrates supply bypassing and building the high power magnetics required for high power Class-D designs. The board comes fully assembled and is mounted to a machined heatsink. The Class-D reference design kit is extremely versatile. After evaluating a design with the preloaded 500V, 30A DRF1300 hybrid, applications can be modified for higher voltage requirements by using the 1000V, 15A DRF1301 Driver/MOSFET hybrid. The DRF1300 hybrid features an air cavity-flangeless package for improved reliability over plastic encapsulated packaging. Constructed with materials with closely matched CTEs the flangeless package maximizes system reliability by alleviating the stress between components during power cycling. Typical applications have demonstrated in excess of 1 million cycles with power densities of 700 Watts/square inch. The flangeless package design also reduces cost, eliminating expensive copper tungsten flanges that are typical in conventional high power RF packages. DRF1300/Class-D reference design kits are available now, with a unit price of $1600. Samples of the DRF1300 and DRF1301 Driver/MOSFET hybrids are also available now. Additional DRF1300 hybrids are available for a unit price of $225.00 in 100 piece quantities. All devices are available through the factory or from authorized distributors of Microsemi RF products. About Microsemi Corporation Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals. Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance, reliability and battery optimization, reducing size or protecting circuits. The principal markets the company serves include implantable medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its web site at http://www.microsemi.com. The Microsemi Corporation logo is available at http://www.primenewswire.com/newsroom/prs/?pkgid=1233 PLEASE READ THE FOLLOWING FACTORS THAT CAN MATERIALLY AFFECT MICROSEMI'S FUTURE RESULTS. "Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements concerning our expectations regarding new or existing products or technologies, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, and inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances. Investor Inquiries: Robert C. Adams, Microsemi Corporation, Irvine, CA (949) 221-7100. CONTACT: Microsemi Corporation Financial Contact: John W. Hohener, Vice President and CFO (949) 221-7100 Investor Relations: Robert C. Adams, Vice President Business Development & Investor Relations (949) 221-7100
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