Aviza Technology, Inc. engages in the design, manufacture, sale, and support of semiconductor capital equipment and process technologies for the semiconductor industry and related markets worldwide. It offers both front-end-of-line and back-end-of-line systems and process technologies using critical thin film formation technologies, such as atomic layer deposition (ALD), physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma etch (Etch), and thermal processing systems. The company's ALD systems include Celsior fxP, a single-wafer, multi-chamber cluster solution configurable to both 200 millimeter (mm) and 300 mm wafer sizes; and Verano 5500, a batch wafer processing solution for 300 mm wafers. It also offers Sigma fxP, a system used to sputter uniform layers of pure metals or metal alloys, and metal compounds, such as oxides or nitrides; Delta fxP system for applications in shallow trench isolation, pre-metal dielectric, inter-metal dielectric, and final passivation layer; Delta i2L cluster system for processing wafers up to 200 mm in size; 1500 atmospheric pressure CVD (APCVD) systems for processing 200mm wafers addressing design-rule fabrication capability of 0.15 micron; 1000 APCVD system offering either hybrid or TEOS-reactant processes; and 999R APCVD and TEOS999 APCVD systems for production lines employing between 100mm and 150mm wafers. Aviza's Etch systems include Omega fxP that offers up to six process modules plus in-line stations to allow for the alignment and the cooling down of the wafer; and Omega i2L that features plasma source technologies in a single-chamber format. Its thermal processing systems include RVP-300plus for processing 300mm wafers; RVP-550, a flexible batch heating system to process loads up to 100 wafers; RVP-200 and AVP-200 for processing 8-inch and 6-inch wafers; and VTR systems for processing wafers from 100mm to 200mm. Aviza was incorporated in 2003 and is headquartered in Scotts Valley, California.