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alan81

01/22/06 1:03 AM

#429 RE: Ixse #428

Uhhh, no.
90nm flash is still al interconnect and 200mm wafers.
BTW Intel was also producing flash at 130nm (not only 180nm as was previously implied
Actually, that is not what I meant. INTC factories that can run 180nm logic can also run any generation of Flash (180, 130, and 90nm)... INTC factories that ran 130nm logic are equiped with copper metalization, and are not available (right now) for flash. INTC factories that run 90nm logic are on 300mm wafers and are not available for flash either.
OK, here is one reference, the INTC factory cheat sheet:
http://www.intel.com/pressroom/kits/manufacturing/manufacturing_at_a_glance.pdf
You will notice that they build 90nm flash at fab 18 and D2, which is a 200mm factory.
--Alan
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alan81

01/22/06 1:10 AM

#430 RE: Ixse #428

more on 90nm communications technology
Here is a presentation with some details:
ftp://download.intel.com/technology/silicon/Bohr_IDF_0902.pdf
slide 26
Features added for 90 nm communication process:
− High voltage RF analog CMOS transistors
− Precision capacitors and resistors for analog circuits
− High-Q inductors and varactors
− SiGe heterojunction bipolar transistors (HBTs)
Basic features shared with 90 nm logic process:
− High performance, low power digital CMOS
transistors using strained silicon technology
− 7 copper interconnect layers + new low-k dielectric
− 1.0 µm2 SRAM memory cell size
− 300 mm wafers
--Alan