Spokeshave -
You have won the prize for most wrong points in a single post. In fact I can't find anything in there that's correct, including your claim that I claim to be a process expert. I have stated many times that I am not a process expert. My expertise is in manufacturing (post fabrication), test and design for test. The overwhelming number of defects can be modeled and predicted and are simply not design specific despite your claims that they are. Design rules are in place to ensure that designs are not subject to their own unique failure modes to any significant extent. For a mature process, most defects are particulate in nature with a smattering of other more obscure failure modes. Early on you will see more exotic failure types but those would be worked out by now for AMD's .13u process. That's why it is easy to calculate how AMD can produce the current demand for their bulk .13u products with half a fab, unless there is something very very wrong. I'm giving AMD the benefit of the doubt and assuming their .13u process is running well.