"Things like higher bin splits/yields could easily offset the added cost of SOI."
And they do. Until recently, everybody had a process that was more similar than it was different. Sometimes you would have a company like DEC, and they would develop a process that used different materials for a specific purpose, but most didn't do that. So a few parameters like defect density were enough to give an idea of how well a given company was doing. That has changed. SOI, low-k dielectrics, high-k dielectrics, metal gates, etc. all push the various processes away from each other for easy compares. In addition, all kinds of other things rear up, like static leakage, and the companies all cope in different ways. So there isn't a simple way to compare any more.
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