What was INTC's previous guidance on CAPX for 2003?
I don't know the exact figure but obviously it was higher. What can we conclude from that? I think the conclusion is that under current conditions Intel does not see a need to expand capacity at an accelerating pace. The bringing online of F11x at ~200,000 sqft of cleanroom space makes it about twice the size of the competition's single fab. With 300mm wafers producing ~2.2x the number of die as a 200mm wafer it looks to me as though Intel brought online 4.4x the capacity with a single fab. With Prescott's die size being well under 100mm2 it just about doubles capacity again compared to the current generation of Intel processors, and there are more 300mm fabs. Would you be building more fabs under the circumstances? I think that somewhere you have a point you are trying to make but I can't figure out what it is. Please explain your point. If this is just a hit & run bashing then don't waste our time.