Nice idea, but how are you going to cool such a device?
Tenchu
Just thinking out loud here, but I think I can answer that question, by asking a question or two that may cause people to think outside the box..... WAG coming.....
Is it really the entire die that generates the same level of heat, or would you suppose there may be some areas of the die that are hotter then others? And assuming the answer is yes, can anyone think of any way possible to target those specific areas? Are big heat sinks, or similar cooling solutions mounted to the package the only way?
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