Replies to post #3208 on Viaspace, Inc. (VSPC)

[tommy 9 fingers]

Also BigD has posted a new research report in the I-BOX or sticky section. It is 65 pages it will tell you everything including the history of the company.

Also on the patent it talked about the wafers now being able to lay horizontal vs. vertical.

This means cells, phones, iPod, and game devices and if you look at the post for the last two days someone contacted Dr. J in IR and he confirmed that if it comes to the USA and has fuel cells in it they will get a piece of the action if I understood that correctly.

Tosiba just put 3000 units into a market test in Japan of what looks like older tech. From what I understand this is the first time any of the players have gone to market and that is why we are feeling that with in the next year these products should be on the market. Plus either Samsung or Toshiba did a demo of a cell phone with DMFC power in it at a tradeshow recently. They said it was a little thick and had plans of making it smaller or thinner before going to market.

We are also hoping to hear about contracts with DP for the GKG this months or very soon as well.