Sarmad
There is a consistent theme among some posters that assumes a wide range of variability in modern processes.
Going into 45nm currently only offers performance-advantages if you use technologies like MG/Hi-K stacks - which come at a price: It significantly increases variation.
If that is so then Klaus' claims about DFM (Design for Manufacturability?) might make sense. If Intel suffers the yield problems that AMD suffers then as Klaus points out they would need to find a way to sell the die that fall on the slow side of the distribution, and Silverthorne, as a product line comprised of both a separate small die design and a downbinned and defeatured Penryn, might make sense. It's at least plausible. However all this assumes process variation that necessitates such a recovery strategy. I think it is only natural for those who are associated with AMD to assume that AMD's process is "World Class" and Intel's must be similar in yield and variation as we progress to 65nm and below. By making all these assumptions it is possible that Klaus may actually believe what he's saying. That doesn't make him right though.
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