calbiker - Are you suggesting that somehow "the great calbiker" is free of the laws of physics that the rest of us have to adhere to? Regardless how much you deny it, when you add a relatively inefficient thermal junction(die-to-IHS or any other similar junction) between the die and the ultimate "sink" for the thermal transfer - that is, the air - you lose efficiency. Period. This inefficiency can be minimized, which from the early post I saw on vr-zone.com, is what I suspect Intel did with Prescott, but it is still there. It is inescapable. Drop it, you'll never convince anyone who has any knowledge of physics or thermodynamics. You might want to search back through the SI moderated AMD forum, if you have access. There was a substantial discussion on it once. Mani, who established the forum there is an expert in the field.
Paul