Replies to post #1 on Sharing Knowledge in Smallcaps

[EZ2]

GOOD LUCK w/ the board....got it "marked" !!
EZ :)

[Incite101]

Electroless technology is becoming an important element of wafer scale packaging growth particularly as DRAM, Flash, and other memory technologies adopt stacked die and other wafer based packaging configurations. The use of electroless metal plating is key for producing cost-effective RFID components. Use as metallization on the backside of wafers enables a low thermal metal path for attachment of heat sinks and thermal devices critical for processor and graphic IC performance
Surfect Technologies' innovative single-cell electro-deposition process and tool capabilities enable low-cost manufacturing of bumps and metal interconnect on wafers (200mm or 300mm) with improved repeatability at high speeds. The Surfect machine Models; Rio E-Less and Leapfrog 300mm, provide customers with the high utilization rates needed to meet the demanding production needs of wafer bumping and through-hole via plating
http://www.nanalyze.com/forums/topic.asp?TOPIC_ID=1512 M/C $33M http://finance.yahoo.com/q/ks?s=SUFH.OB