Replies to post #21611 on Advanced Micro Devices Inc (AMD)

[CombJelly]

"That means that AMD in fact can make two separate dices and assemble them together into single body"

Yes they could, but they probably won't. Two reasons. One, the performance wouldn't be quite as high because it takes more time to go off on chip and onto another. The biggest reason, though, is that it would require a special package(think Pentium Pro). And that would require a special motherboard, etc. One of the attractive things that AMD could do with their multi-core design is make it so that it fits into a socket 940. As wanna has mentioned, power consumption is a concern. I suspect this is why AMD has thrown 2005 as the time of the dual core, they should have their reduced power versions well tested on 90nm by then.

[Milo Morai]

I think separate L1's, but I think a single L2 is more likely. Base on previous cLDT drawings.

[j3pflynn]

yb, I doubt that would be their approach. Why would they want the extra packaging costs and the problems with interdie signals, when they can do it all on one die with lithography?
Paul