Ixse, thanks for the slides! Intel does seem to expect their cost per die to continue to drop - their expectation is that their 300mm costs will come down faster than they add cache, I guess.
Terminology: We had a discussion here a while back on the plural of die. In gaming, of course, it is dice. Others insist it should be dies. I notice that in Intel's slides, die is its own plural, as in slide 43: Geometry & Technology Driving Die per Wafer.
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